Placement device and placement method

A placement device and placement technology, applied in the field of electronic component placement devices, can solve the problems of low control accuracy and cost increase, and achieve the effects of easy disassembly and replacement, compact structure, and saving maintenance time

Inactive Publication Date: 2011-06-08
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the system's complex control program and expensive ball screw caused a huge cost increase
The third type is a transmission control system using a stepping motor and a synchronous conveyor belt. This system is relatively simple, but the control accuracy is not high.

Method used

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  • Placement device and placement method
  • Placement device and placement method
  • Placement device and placement method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The electronic component placement device of the technical solution will be further described in detail below in conjunction with the drawings and embodiments.

[0018] see figure 1 , the embodiment of the technical solution provides a mounting device 100 for mounting electronic components on a printed circuit board. The placement device 100 includes a fixed frame 10 , a servo motor 20 , a coupling 30 , a placement spindle 40 , a placement suction nozzle 50 , a protection spring 60 , a sensor device 70 and a bushing 80 .

[0019] The fixing frame 10 includes a first receiving frame 11 and a second receiving frame 12 . The shape and size of the first receiving frame 11 correspond to the servo motor 20 and are used to accommodate the servo motor 20 . The shape and size of the second receiving frame 12 correspond to the coupling 30 and the mounting spindle 40 , and are used to accommodate the coupling 30 and part of the mounting spindle 40 .

[0020] The servo motor 20 ...

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PUM

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Abstract

The invention provides a placement device comprising a servo motor, a placement main shaft, a placement sucker and a sensing device. The servo motor is connected with the placement main shaft and is used for driving the placement main shaft to rotate; the placement main shaft is connected with the placement sucker and is used for driving the placement sucker to rotate; the placement sucker is used for sucking an electronic element for placement; and the sensing device is connected with the servo motor and is used for sensing a rotating angle of the placement main shaft and generating a sensing signal when the placement main shaft rotates to a preset angle so that the servo motor drives the placement main shaft to stop rotating according to the sensing signal. The placement device has lower cost, reasonable structure, good exchangeability, and the placement precision and the efficiency satisfy the production requirements. The invention also provides a method for placing electronic elements by utilizing the placement device.

Description

technical field [0001] The invention relates to the technical field of electronic component placement, in particular to an electronic component placement device and a placement method. Background technique [0002] Printed circuit boards and integrated circuit chips are widely used spare parts in electronic consumer products. On printed circuit boards and integrated circuit chips, electronic components such as resistors, capacitors, and inductance components need to be mounted and welded. Surface Mount Technology (SMT) has been widely used in the assembly of electronic components and printed circuit boards due to its high reliability and ease of automation. See Stretchable Electronic Systems, IEEE Electronics Packaging Technology Conference, 6-8 Dec. 2006 Page(s): 271-276. However, it is necessary to rely on high-precision and high-efficiency placement machines to mount and solder electronic components with smaller and smaller sizes and various shapes and specifications on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 魏哲毕庆鸿涂成达李文钦
Owner AVARY HLDG (SHENZHEN) CO LTD
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