Manufacturing method of high-density heat dissipating device with multiple heat dissipating fins

A manufacturing method and technology of a heat dissipation device, which are applied in the directions of manufacturing tools, casting molding equipment, casting molds, etc., can solve problems such as being less than ideal, affecting heat conduction efficiency, and failing to conduct heat dissipation fins smoothly.

Inactive Publication Date: 2009-12-30
李信宇
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Problems solved by technology

The fifth production method is to bond the two parts of the heat sink and the heat sink base with an adhesive to form a heat sink that is not limited by the multiple and density of the heat sink. The heat dissipation effect is still not

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  • Manufacturing method of high-density heat dissipating device with multiple heat dissipating fins
  • Manufacturing method of high-density heat dissipating device with multiple heat dissipating fins
  • Manufacturing method of high-density heat dissipating device with multiple heat dissipating fins

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Embodiment Construction

[0062] In order to further explain the technical means and effects that the present invention adopts to achieve the intended invention purpose, the following in conjunction with the accompanying drawings and preferred embodiments, the manufacturing method of the high-density heat dissipation device with high multiple heat dissipation fins proposed according to the present invention Specific embodiments, structures, features and effects thereof are described in detail below. For convenience of description, in the following embodiments, the same elements are denoted by the same numbers.

[0063] see Figure 1 to Figure 4 , which discloses a first embodiment of the present invention, that is, a diagram of an embodiment of a high-density heat dissipation device for producing lateral high-multiple heat dissipation fins.

[0064] Please refer to figure 1 As shown, the mold 10 used in this embodiment is composed of a bottom block 12, a plurality of corresponding and stacked dies 11...

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Abstract

The invention relates to a manufacturing method of a high-density heat dissipating device with multiple heat dissipating fins, mainly comprising the following steps: the multiple processed heat dissipating fins are placed into a heat dissipating fin containing groove of a mould, then heat conducting metal (such as aluminum and copper) in a melting state is poured into the containing groove of the mould so that the heat dissipating fins are coagulated and combined with the heat conducting metal in the melting state, and the combined heat dissipating fins and heat conducting metal are cooled and then demoulded to directly form the heat dissipating device. The manufacturing method can be used for manufacturing transverse and longitudinal high-density heat dissipating devices with the multiple heat dissipating fins, thereby making the mass production of the heat dissipating devices more convenient and also enabling the heat dissipating devices to more accord with industrial demand.

Description

technical field [0001] The invention relates to a method for manufacturing a high-density heat dissipation device, in particular to a method for manufacturing a high-density heat dissipation device with high-multiple heat dissipation fins. Background technique [0002] As far as the current heat dissipation technology is concerned, there are five manufacturing methods, especially for the production of heat dissipation devices for electrical products: (1) aluminum extrusion, (2) die casting, (3) cold forging, (4) cutting, (5) ) bonding. Although the first four production methods can produce integrated cooling devices, the size and quantity of the cooling fins are limited by a certain ratio of length, width and height. If the size multiple and arrangement density of the heat dissipation fins can be increased, the heat dissipation area can be increased, thereby improving the heat dissipation efficiency. The fifth production method is to bond the two parts of the heat sink and...

Claims

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Application Information

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IPC IPC(8): B22D19/04B22C9/26
Inventor 李信宇
Owner 李信宇
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