Method for synthetically recycling waste printed circuit board

A printed circuit board and waste technology, which is applied in the field of waste printed circuit board recycling and processing, can solve the problems of high cost and low efficiency, and achieve the effects of low recycling cost, simple follow-up treatment and simple equipment.

CN101623698AInactive Publication Date: 2010-01-13CENT SOUTH UNIV

3 Cites 33 Cited by

Patent Information

Authority / Receiving Office: CN · China
Current Assignee / Owner: CENT SOUTH UNIV
Publication Date: 2010-01-13
Estimated Expiration: Not applicable · inactive patent

Smart Images

Figure 1

Patent Text Reader

Abstract

The invention provides a method for synthetically recycling a waste printed circuit board. The method comprises the following steps: (1) the waste printed circuit board with electronic elements is placed in a rotary drum and dipped in a liquid heating medium to melt soldering tin on the waste printed circuit board, the rotary drum is rotated, and the melted soldering tin can be filtered by passing through filtering holes on the wall of the rotary drum under the centrifugal effect of the rotation of the rotary drum; (2) the falling electronic elements are classified, sorted and further processed; and (3) the waste printed circuit board is coarsely crushed by adopting a cutting type crusher after the soldering tin and the electronic elements are removed, a fine crusher is adopted to fine crush the coarsely crushed printed circuit board to ensure that metal and nonmetal are mutually dissociated, and the dissociated mixing materials are separated by a pneumatic separator or a static separator to respectively obtain copper powder and nonmetal powder. The invention realizes scale treatment of the waste printed circuit board with low cost and high efficiency, and ensures that valuable substances such as nonmetal, soldering tin, copper and other metal are synthetically recycled.

Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the technical field of recycling waste printed circuit boards, and relates to a method for comprehensively recycling waste printed circuit boards. Background technique

[0002] With the rapid development of the electronic and electrical industry and the improvement of people's living standards, the lifespan of electronic products is shortening day by day, and the number of eliminated electrical appliances is increasing. As an important part of electronic products, the waste of printed circuit boards is also quite large. Waste printed circuit boards contain valuable substances such as gold, silver, palladium, platinum, copper, aluminum, etc., as well as harmful substances such as lead, cadmium, and brominated flame retardants. Resourceful and environmentally sound. In recent years, the treatment of waste printed circuit boards has received worldwide attention, and a lot of research work has been carried out. At present, the t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine

Login to View More