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Application of a viscous medium onto an electronic substrate

A technology of electronic substrates and viscous media, applied in the direction of electrical components, electrical components, etc., can solve the problem of performance reduction per unit area and achieve the effect of space reduction

Inactive Publication Date: 2013-06-19
ASM ASSEMBLY SYST GMBH & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Correspondingly, the performance per unit footprint decreases

Method used

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  • Application of a viscous medium onto an electronic substrate
  • Application of a viscous medium onto an electronic substrate
  • Application of a viscous medium onto an electronic substrate

Examples

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Embodiment Construction

[0088] The views in the accompanying drawings are schematic. It should be pointed out that in different views, similar or identical elements are provided with the same reference signs or with reference signs which differ from the corresponding reference signs by only the first digit.

[0089] Figure 1a shows a high performance production line 100 according to an embodiment of the present invention. The production line 100 comprises a carrier loader 104 which feeds carrier elements 103 to two conveyor lines, namely a first conveyor line 101 and a second conveyor line 102 .

[0090] The production line 100 also includes a plurality of electronic component placement machines 120 , 110 arranged in a row along the two transport lines 101 and 102 . The conveying lines 101 and 102 arranged parallel to one another serve to convey the carrier element 103 . The carrier element 103 is suitable for carrying singulated electronic substrates or printed circuit boards, which have a signifi...

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Abstract

It is described an apparatus (150) for applying a viscous medium onto predefined surface portions of an electronic substrate (160). The apparatus (150) comprises an application device (180) for the viscous medium and an interface (130). The interface is designed for attaching the apparatus (150) to an electronic component placement machine (120). By integrating the apparatus (150) at least partially within the placement machine (120), it is no longer necessary to provide a manufacturing line (100) for electronic circuit arrangements with separate viscous medium application machines. Therefore, high performance manufacturing lines (100) can be realized within a limited production floor space. It is further described an electronic component placement machine (120) and a manufacturing line (100) both comprising the above described application apparatus (150). Further it is described a method for applying a viscous medium onto electronic substrates (160) taking benefit from the above described application apparatus (150).

Description

technical field [0001] The invention relates to the field of manufacturing electronic component assemblies. In particular, the present invention relates to an apparatus for applying a viscous medium such as solder paste onto a predetermined surface portion of an electronic substrate before mounting electronic components on the substrate by means of an electronic component mounter. The invention also relates to an electronic component mounting machine for mounting electronic components on an electronic substrate, and a production line for producing electronic circuit devices. Furthermore, the invention relates to a method for applying a viscous medium to a predetermined surface portion of an electronic substrate, in particular for applying solder paste and / or conductive paste to predetermined conductors formed on a printed circuit board on the binding area. Background technique [0002] High-performance production lines for the production of electronic circuit assemblies of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0469
Inventor R·格雷W·利格尔
Owner ASM ASSEMBLY SYST GMBH & CO
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