Silicon capacitance microphone

A silicon condenser microphone and micro-electromechanical chip technology, applied in the field of microphones, can solve the problems of low signal-to-noise ratio and not large enough, and achieve the effects of good shielding effect, improved signal-to-noise ratio, and increased space

Inactive Publication Date: 2010-02-17
AAC ACOUSTIC TECH (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The microphone of this kind of structure acts on the MEME chip 17' from the front due to the sound pressure, a

Method used

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  • Silicon capacitance microphone
  • Silicon capacitance microphone
  • Silicon capacitance microphone

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Embodiment Construction

[0020] The present invention will be further described below with reference to the drawings and embodiments.

[0021] The silicon condenser microphone provided by the present invention is mainly used in mobile phones to receive sound and convert the sound into electric signals.

[0022] See figure 2 The silicon condenser microphone 1 provided by the present invention includes a circuit board 11, a cover plate 12, and a cavity 17 formed by the cover plate 12 and the circuit board 11. The microelectromechanical chip 14 and the control circuit chip 15 are arranged in the cavity 17, and The MEMS chip 14 and the control circuit chip 15 are respectively arranged on the cover plate 12. The microelectromechanical chip 14 is provided with a back cavity 141.

[0023] The cover plate 12 includes a bottom plate 122 and a side plate 121 extending from the bottom plate 122 toward the circuit board 11, and the side plate 121 is connected to the circuit board.

[0024] A sound hole 123 is provided ...

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Abstract

The invention provides a silicon capacitance microphone which comprises a circuit board and a cover board, wherein the cover board is connected with the circuit board, and the cover board is providedwith a sound hole. The silicon capacitance microphone also comprises a micro-electromechanical chip and a control circuit chip, wherein the micro-electromechanical chip is provided with a back cavity;the control circuit chip is electrically connected with the micro-electromechanical chip; the circuit board and the cover board form a cavity; the micro-electromechanical chip and the control circuitchip are positioned in the cavity and respectively arranged on the cover board; and the cover board comprises a bottom board and a side board which extends from the bottom board and is connected withthe circuit board. The silicon capacitance microphone also comprises a shielding sheath, wherein the shielding sheath comprises a body and a crimping side connected with the body; the body of the shielding sheath covers the side board and the bottom board of the cover board, and the crimping side of the shielding sheath is positioned outside the circuit board; the circuit board is fixed with thecover board by the crimping side; the position of the shielding sheath, corresponding to the sound hole, is provided with an opening, and the back cavity of the micro-electromechanical chip is opposite to the sound hole. The signal-to-noise ratio of the silicon capacitance microphone is improved, and the shielding effect is favorable.

Description

Technical field [0001] The invention relates to a microphone, in particular to a silicon condenser microphone. Background technique [0002] With the development of wireless communication, there are more and more mobile phone users in the world. The user's requirements for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects, especially with the current development of mobile multimedia technology. The call quality is more important. The microphone of the mobile phone is used as the voice pickup device of the mobile phone, and its design directly affects the call quality. [0003] At present, the most widely used microphone with better performance is the Micro-Electro-Mechanical-System Microphone (MEMS for short). For related technologies, see figure 1 , The micro-motor system microphone 1'includes a circuit board 11', a frame 12' connected to the circuit board 11' and an upper board 13' connected to the frame 12', wherein the cir...

Claims

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Application Information

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IPC IPC(8): H04R19/04H04R1/00
Inventor 吴志江陈兴福苏永泽
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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