High-temperature brazing filler metal
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- HARBIN INST OF TECH
- Publication Date
- 2010-02-24
Abstract
Description
technical field
[0001] The invention relates to a solder. Background technique
[0002] The chemical activity of the composite material is low, and it is difficult for the conventional solder to wet its surface. The existing method uses Ag-Cu-Ti active solder to carry out active brazing of the C / SiC composite material and the Ti alloy, and the obtained C / SiC after brazing The room temperature shear strength of the joint between SiC composite material and Ti alloy is 84MPa~160MPa, and the shear strength of the joint at 500°C is 51MPa~104MPa. The use temperature of the joint obtained by this method is below 500°C, and the Ag-Cu-Ti active solder The use temperature of the material is 400℃~500℃. Contents of the invention
[0003] The technical problem to be solved by the present invention is to provide a high-temperature solder to solve the problem of low shear strength of joints obtained by brazing composite materials using the existing solder.
[0004] The high-temperature...