Window type semiconductor packaging structure capable of avoiding stripping in mold flow inlet

Abstract

The invention discloses a window type semiconductor packaging structure capable of avoiding stripping in mold flow inlet, which mainly comprises a substrate, a chip of which the active surface is adhered onto the substrate, a chip adhering layer adhering the chip and the substrate core layer of the substrate, two or more weld lines and a mold sealing colloid. One end of a slotted hole of the substrate is formed into a mold flow beyond the chip; two or more mold flow restraining blocks are attached to the substrate core layer and positioned in places where the edge of a chip adhering zone meetsthe two sides of the slotted hole and slightly protrudes from the two sides of the mold flow inlet to restrain the impact of the mold flow on the mold sealing colloid from causing the stress of the chip adhering layer to avoid stripping in the mold flow inlet and maintain a chip adhesion clearance.

Description

technical field [0001] The present invention relates to a semiconductor device, in particular to a window-type semiconductor package structure that prevents mold flow inlets from being peeled off. Background technique [0002] In the existing semiconductor packaging structure, the chip is adhered on the substrate with a die-bonding layer, and the chip is sealed with a molding compound. When the substrate is provided with a window for internal electrical connection, the molding compound should be able to be formed on the substrate and in the window. There will be a narrow mold flow inlet between the upper surface of the substrate and the window, so the injection pressure when forming the molding compound will exert impact stress on the die-bonding layer on both sides of the mold-flow inlet, resulting in volume compression of the die-bonding layer Or deformation, or even intrusion into the bonding interface, affecting the packaging quality. [0003] see figure 1 As shown, a...

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Problems solved by technology

[0004] In addition, China Taiwan Province Invention Patent Certificate No. I291751 proposes a packaging structure to prevent the die-bonding glue from contaminating the chip pads. A solder shield is formed on both sides of the line groove hole to prevent the die-bonding adhesive from contaminating the chip pad during die-bonding, but for the stress deformation or peeling of the die-bonding layer on both sides of the die-flow inlet caused by the impact of the mold flow The problem cannot be effectively solved

Furthermore, since the solder resist layer covers both ends of the slot hole (including the mold flow inlet), the mold flow inlet becomes narrower, and the adverse effect of the mold flow pressure impacting the die-bonding layer on both sides of the mold flow inlet is greater. Affected the reliability and manufacturing pass rate of finished products

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