Miniature array electromagnet mounting assembly

Abstract

The invention relates to the technical field of chip mounters, in particular to a mounting structure of the chip mounter, and discloses a miniature array electromagnet mounting assembly which is assembled by a plurality of mounting heads capable of independently working in rows and arrays. A suction nozzle is moved up and down by the mounting head adopting an electromagnet; the direction positioning of all the suction nozzles of the mounting heads is controlled by a stepper motor; a shell, the lifting of the suction nozzle and a rotation mechanism are kept in a same axial lead; and the suctionnozzle is provided with a retractable damping device, thus effectively releasing the impact on a component, and simultaneously compensating the component mounting with unequal thickness. The mountingassembly is neatly integrated, has reasonable structure, simple and direct transmission link, small volume, light weight and effective response speed and facilitates flexible integration.

Description

【Technical field】 [0001] The invention relates to the field of placement machines for electronic assembly, in particular to the technical field of placement heads and suction nozzles of placement machines. 【Background technique】 [0002] With the advancement of electronic technology and the rapid development of electronic product manufacturing, the processing technology of mounting electronic components on printed circuit boards is increasingly adopted by many electronic manufacturers. To mount components with ever-shrinking dimensions on circuit boards, more use of electronic assembly and placement machines is required. In the high-speed operation state, the components are directly sucked from the component tape and accurately mounted on the circuit board. The placement head is a very critical component, and its response speed and running accuracy are similar to the placement head. Structure and weight have a direct relationship. [0003] In the existing technologies at h...

AI Technical Summary

Problems solved by technology

[0003] In the existing technology at home and abroad, the structure of the placement head is complicated, and the volume of the placement head is relatively large, which makes the placement head heavy and clumsy, and finally leads to a correspondingly large volume of the whole machine. At present, the common problem that restricts the improvement of the placement head's working accuracy One is that there are too many mechanical transmission links and the difficulty and complexity of improving the precision of mechanical transmission

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