Electronic component with lead wire

A technology of electronic parts and leads, which is applied in the direction of resistor parts, fixed capacitance parts, electrical components, etc., can solve the problems of reduced detection sensitivity and low thermal conductivity of insulating resin, and achieve increased contact area and full bonding Strength, not prone to bridging or shifting effects

Inactive Publication Date: 2010-03-24
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] However, since the insulating resin constituting the heat-shrinkable insulator 115 has low thermal conductivity, when these areas are covered with the heat-shrinkable insulator 115, the detection sensitivity is lowered compared to the case where the heat-shrinkable insulator 115 is not provided.

Method used

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  • Electronic component with lead wire
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  • Electronic component with lead wire

Examples

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Embodiment Construction

[0075] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0076] figure 1 It is a front view of an embodiment of a surface mount type thermistor as an electronic component used in the electronic component with leads of the present invention, figure 2 is its cross-sectional view.

[0077] figure 1 and figure 2 Among them, the thermistor 1 is provided with a thermistor body 2 formed in a substantially rectangular parallelepiped shape and mainly composed of a ceramic material, and Ag, Cu, Ni, etc. , Sn and other conductive materials made of terminal electrodes 3a, 3b.

[0078] The terminal electrodes 3a, 3b have end faces 4a, 4b and side folded portions 5a, 5b, such as figure 2 As shown, the terminal electrodes 3a, 3b cover the end surfaces 6a, 6b of the thermistor body 2 and the four sides of the thermistor body 2 .

[0079] Since such a surface mount type thermistor 1 is used, compared with a single-p...

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PUM

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Abstract

The present invention provides an electronic component including a lead wire, which has improved bonding strength with a simple structure and low cost and which has improved electrical connection andhigh reliability. In an electronic component, first and second lead wires include coated portions and first and second metal wire exposed portions. The coated portions include metal wires that are coated with insulating members. Each of the first and second metal wire exposed portions have a flat shape. The first lead wire and the second lead wire are arranged parallel or substantially parallel toeach other. The second lead wire is shorter than the first lead wire. The first metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The second metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The first and second metal wire exposed portions are located substantially in the same plane. A solder fillet is provided not only on the side surface folded portions, but also on end surface portions and in a gap.

Description

technical field [0001] The present invention relates to an electronic component with leads, and more specifically, to an electronic component with leads in which electronic components such as a thermistor are arranged away from a mounted control substrate. Background technique [0002] In computers, electric bicycles, etc., there are cases where a large secondary battery is used or a plurality of fuel cells are installed and used simultaneously. In this case, for example, it may be necessary to separate a place where temperature is to be measured, such as a secondary battery, from a control board on which a thermistor serving as a temperature sensor is mounted. Therefore, use a leaded thermistor with long gauge leads. That is, by using a temperature sensor with leads, it is possible to place the temperature sensing part of the thermistor near the parts to detect the temperature while fixing the leads to a control substrate such as a printed circuit board by soldering, so th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R4/02G01K7/22H01C7/02H01C7/04
CPCG01K7/223H01C7/008H01C7/18H01G4/232H01C1/144
Inventor 仕子正伦奥山晋吾四宫祐一白木秀幸三宅和夫
Owner MURATA MFG CO LTD
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