Semiconductor refrigeration camera shield

Abstract

The invention relates to a semiconductor refrigeration camera shield which mainly comprises a semiconductor camera sheath, a semiconductor camera inner bushing, a cooling fin, a bracket, a baseplate, an axial flow fan, a refrigeration sheet, a temperature guide plate and a semiconductor camera rear cover. A sheath front flange is installed on a front end part in a sheath sleeve; a temperature insulation layer is arranged on the inner wall of the sheath sleeve; a cooling window is arranged below the rear part of the sheath sleeve; the lower part of the semiconductor camera sheath is connected with the cooling fin; and the axial flow fan is installed at the lower part of the baseplate. On the basis of energy conservation law, according to the refrigeration character of semiconductors, a semiconductor refrigeration camera is designed from the aspect of the design of mechanical mechanisms, so that the refrigeration and heating effects of the semiconductors reach using requirements, and the advantages of reasonable structure, attractive appearance and high cost performance can be achieved; in addition, most of workpieces of the main structure of the semiconductor refrigeration camera shield are round discs or in a cylindrical shape, therefore, the semiconductor refrigeration camera shield is processed simply, and the cost is reduced greatly in comparison with conventional similar equipment, thereby achieving wide application and promotion values.

Description

Technical field [0001] The invention relates to a camera protection device, in particular to a semiconductor refrigeration camera protection cover used in industries such as steel, electric power, glass, cement, petrochemical and the like. Background technique [0002] In the early 1970s, our scientific and technical personnel used semiconductor cooling and heating technology to protect cameras in harsh environments. This protective cover is especially suitable for no cooling medium (cooling gas cooling water), high dust density and high ambient temperature. Or a place where people cannot stay at ultra-low temperature; the camera in the semiconductor refrigeration hood can replace people to monitor the work surface. [0003] Over the years of practical application, the device has its stable electrical performance, that is, stable cooling and heating functions, but its structure is more complex, the machining volume is large, the assembly is cumbersome, and the cost is high. The exi...

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Problems solved by technology

[0003] Over the years of practical application, the device has stable electrical properties, that is, stable cooling and heating functions, but its structure is complicated, the amount of machining is large, the assembly is cumbersome, and the cost is high. The existing problems include 1. The cover body is rectangular , the inner and outer three-layer junctions are all veneers; the cumulative error is large, and assembly is difficult; 2. The front and rear support frames are square, and all surfaces need to be machined to obtain, and the processing volume is large; 3. The shape is rectangular, which is not beautiful; 4. Large size and heavy weight; 5. High cost

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