Piezoelectric type grinding force measuring device for ultraprecise grinding machine of silicon wafer

A measuring device, ultra-precise technology, applied in the field of sensor measurement and control, can solve problems such as difficult to monitor the grinding force accurately and in real time, cannot accurately determine the grinding force component Fx, etc., to improve reliability and production efficiency, hysteresis Small, highly sensitive effects

Active Publication Date: 2010-06-02
DALIAN UNIV OF TECH
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Problems solved by technology

Since there are many factors that affect the current of the spindle motor during the grinding process, it is difficult for this indirect detection met

Method used

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  • Piezoelectric type grinding force measuring device for ultraprecise grinding machine of silicon wafer
  • Piezoelectric type grinding force measuring device for ultraprecise grinding machine of silicon wafer
  • Piezoelectric type grinding force measuring device for ultraprecise grinding machine of silicon wafer

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[0020] Example: The laboratory room temperature is 26°C, and the sensitivity of the charge amplifier YE5850B is S X =7.93pc / kgf, S Y =7.85pc / kgf, S Z =3.53pc / kgf, when the axial force acts, the force acts on the piezoelectric quartz force sensor 2 through the base 1, and the quartz crystal surface of a group of xy-type unit crystal groups o' with longitudinal effects will produce a corresponding Charge, the charge is transferred to the electrode v sandwiched between two quartz wafers, and the charge is drawn out through the negative signal lead-out line p of the axial force; when the radial force acts on the measuring device, the piezoelectric quartz force sensor 2 and the bottom plate 1 The friction force between the upper surface and the lower surface of the upper cover 3 applies radial force to the upper and lower surfaces of the piezoelectric quartz force sensor 2 Two groups of yx-type unit crystal groups with shearing effect o 1 , o 2 On the surface of the quartz cryst...

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Abstract

The invention relates to a piezoelectric type grinding force measuring device for an ultraprecise grinding machine of a silicon wafer, which belongs to the technical fields of sensing, measurement and control, in particular relates to detection of the grinding force in the ultraprecise grinding process of the silicon wafer. The measuring device comprises a base, piezoelectric quartz force sensors, an upper cover, connecting screws, a patching board, a trapezoidal sleeve barrel, nuts, a stud bolt, flange fixing screws and a flange, wherein the base is in a circular ring type structure; four piezoelectric quartz force sensors are installed on the upper surface of the base and are uniformly distributed squarely; the base, the upper cover and the piezoelectric quartz force sensors are rigidly connected through the connecting screws to form a dynamometer assembly; and the piezoelectric quartz force sensors comprise two pairs of yx type unit crystal groups and a pair of xy type unit crystal groups. The piezoelectric type grinding force measuring device has the characteristics of simple structure, high sensitivity, good linearity and repeatability and high measuring accuracy, and can be used for detecting the grinding force in the grinding process of the silicon wafer in real time.

Description

technical field [0001] The invention relates to a piezoelectric grinding force measurement device for a silicon wafer ultra-precision grinding machine, which belongs to the technical field of sensing, measurement and control, and particularly relates to the detection of grinding force during the silicon wafer ultra-precision grinding process. Background technique [0002] The development of integrated circuits (ICs) is inseparable from the basic material silicon wafers, and more than 90% of ICs in the world use silicon wafers. In the IC manufacturing process, especially the silicon wafer preparation and chip packaging stages, the ultra-precision processing technology of silicon wafers (including ultra-precision grinding, grinding and polishing) is mainly used for ultra-precision planarization and backside thinning of silicon wafers. [0003] With the rapid development of IC manufacturing technology, IC chips continue to develop in the direction of high integration, high dens...

Claims

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Application Information

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IPC IPC(8): B24B49/16
Inventor 钱敏张军康仁科刘博朱祥龙郭东明
Owner DALIAN UNIV OF TECH
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