Suspending manufacture process of light emitting diode (LED) fluorescent powder

Abstract

The invention provides a suspending manufacture process of light emitting diode (LED) fluorescent powder. In the manufacture process, transparent epoxy resin and fluorescent powder are adopted for coating twice, wherein for the first coating, the transparent epoxy resin is used for exactly covering a wafer, and the wafer is roasted and cured, then a mixed materials prepared from the fluorescent powder and the epoxy resin is coated on the epoxy resin in the first coating, and the wafer is roasted, deposited and cured again, thereby the transparent epoxy resin and the fluorescent powder are uniformly distributed on the surface of an LED lamp cup wafer. In addition, by combining a corresponding finished product detection mode, the fluorescent powder in a produced LED finished product is uniformly covered, thereby the utilization rate of the fluorescent powder in the finished LED product is greatly improved when in use, and the prepared LED light spot has the advantages of uniformity, strong attenuation resisting capability and the like.

Description

【Technical field】 [0001] The invention relates to a manufacturing process of an LED element, in particular to a manufacturing process of LED fluorescent powder suspension for evenly distributing fluorescent powder by means of a suspension method during LED manufacturing. 【Background technique】 [0002] Since the appearance of LED, it has been loved by people because of its energy saving and environmental protection. With the breakthrough of technology, the white LED appears, and its application in the lighting field is becoming more and more extensive. However, phosphor deposition is a problem that has always existed in the white LED manufacturing process. Yes, during the LED production and preparation process, the phosphor powder in it usually produces very serious precipitation after baking, and a part of the phosphor powder precipitates around the wafer, resulting in the phosphor powder coated inside the finished LED product when it is used. The utilization rate is low, c...

AI Technical Summary

Problems solved by technology

[0002] Since the appearance of LED, it has been loved by people because of its energy saving and environmental protection. With the breakthrough of technology, the white LED appears, and its application in the lighting field is becoming more and more extensive. However, phosphor deposition is a problem that has always existed in the white LED manufacturing process. Yes, during the LED production and preparation process, the phosphor powder in it usually produces very serious precipitation after baking, and a part of the phosphor powder precipitates around the wafer, resulting in the phosphor powder coated inside the finished LED product when it is used. Low utilization rate, causing problems such as uneven light spots

In order to solve this problem, the best way is to apply phosphor on the surface of the chip. However, due to the small size of low-power LEDs, how to complete the application of phosphor on the small surface is very difficult technically, and it is a process problem that needs to be overcome urgently in the industry.

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