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Low-temperature chemical tinning solution and tinning method

A tin plating solution and low temperature chemical technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of increasing the cost of tin plating, increasing the cost of waste plating solution treatment, etc., to achieve low cost, The effect of fewer types of chemical materials and easy handling

Inactive Publication Date: 2010-06-30
TAIYUAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The above tin plating methods, or higher working temperature, need to provide more energy; or a wide variety of additives, which increases the cost of tin plating; or uses a higher concentration of hypophosphite, which increases the cost of waste plating solution treatment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A solution:

[0030] Stannous sulfate 20g / L

[0031] 98% concentrated sulfuric acid 20mL / L

[0032] Polyethylene glycol 6000 0.05g / L

[0033] Triethanolamine 0.1g / L

[0034] Pingping plus O 0.02g / L

[0035] The rest is deionized or distilled water.

[0036] Solution B:

[0037] Thiourea 50g / L

[0038] 98% concentrated sulfuric acid 40mL / L

[0039] The rest is deionized or distilled water.

[0040] Plating method: first soak the copper sheet in solution A for 180 seconds, and then soak it in solution B for 300 seconds to complete the plating and obtain a silver-white bright tin-plated layer. The working temperature of the solution is 20°C.

Embodiment 2

[0042] A solution:

[0043] Stannous sulfate 45g / L

[0044] 98% concentrated sulfuric acid 50mL / L

[0045] Polyethylene glycol 6000 0.25g / L

[0046] Triethanolamine 0.4g / L

[0047] Pingping plus O 0g / L

[0048] The rest is deionized or distilled water.

[0049] Solution B:

[0050] Thiourea 20g / L

[0051] 98% concentrated sulfuric acid 20mL / L

[0052] The rest is deionized or distilled water.

[0053] Plating method: first soak the copper sheet in solution A for 30 seconds, and then soak it in solution B for 60 seconds to complete the plating. The working temperature of the solution is 15°C.

Embodiment 3

[0055] A solution:

[0056] Stannous sulfate 30g / L

[0057] 98% concentrated sulfuric acid 30mL / L

[0058] Polyethylene glycol 6000 0.1g / L

[0059] Triethanolamine 0.2g / L

[0060] Pingping plus O 0.01g / L

[0061] The rest is deionized or distilled water.

[0062] Solution B:

[0063] Thiourea 40g / L

[0064] 98% concentrated sulfuric acid 30mL / L

[0065] The rest is deionized or distilled water.

[0066] Plating method: soak the copper alloy in solution A for 90 seconds, then soak in solution B for 180 seconds to complete the plating. The working temperature of the solution is 25°C.

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PUM

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Abstract

The invention provides low-temperature chemical tinning solution and a tinning method; the tinning solution is divided into A solution and B solution, the A solution comprises stannous sulfate, stannous chloride or stannic chloride, concentrated sulfuric acid, polyethylene glycol, triethanolamine and the like; B solution comprises thiocarbamide and concentrated sulfuric acid; the tinning method is as follows: copper or copper alloy is soaked in the A solution for 30-180s, and then is soaked in the B solution for 60-300s, so as to carry out tinning and obtain silvery white bright tinning layer, the solution working temperature is 10-35 DEG C; in the invention, the tinning is stable, tinning speed is rapid, the cost is low, the solution is energy saving and environment-protection and has practical value.

Description

technical field [0001] The invention relates to chemical plating on the surface of metal materials, in particular to a low-temperature chemical tin plating solution and a tin plating method for the surface of copper or copper alloy substrates. Background technique [0002] With the miniaturization of electronic products, the printed circuit board (PCB), which is the carrier of fine lines and microelectronic devices, is also increasingly miniaturized. The traditional hot air leveling process (HASL) can no longer meet the requirements of the electronics industry. The electroless tin plating process has been paid more and more attention due to its excellent multiple solderability, uniform and dense coating, simple process operation, and good safety. If can find a kind of low-cost, simple and fast, energy-saving and environment-friendly electroless tin plating method, people expect especially. [0003] Regarding electroless tin plating, at present, the method of main salt + red...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/31
Inventor 李文娟盛若虹韩红斐郑慧敏
Owner TAIYUAN NORMAL UNIV
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