Full transparent AlGaN/GaN high electron mobility transistor and manufacturing method thereof
A technology with high electron mobility and fabrication method, applied in the fabrication of high-performance devices in the field of full transparency, and in the field of semiconductor devices. The application of transparent electronic devices, etc., to achieve the effect of improving anti-radiation characteristics and improving electrical conductivity
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Embodiment 1
[0031] Embodiment 1, the making of device of the present invention, comprises the following steps:
[0032] Step 1. Epitaxial material growth.
[0033] refer to figure 1 and figure 2 , the specific implementation of this step is as follows:
[0034] (101) On the double-sided polished sapphire substrate, grow a GaN buffer layer by MOCVD process;
[0035] (102) growing an intrinsic GaN layer on the GaN buffer layer;
[0036] (103) On the intrinsic GaN layer, a 20nm thick Al 0.3 Ga 0.7 N layer, intrinsic GaN layer and Al 0.3 Ga 0.7 2DEG is formed between N layers;
[0037] (104) in Al 0.3 Ga 0.7 On the N layer, a 2nm thick GaN cap layer is grown.
[0038] Step 2. Fabrication of source and drain electrodes.
[0039] refer to figure 1 and image 3 , the specific implementation of this step is as follows:
[0040] (201) Using PECVD equipment to protect the surface of the device with SiN coverage;
[0041] First, put the sample in acetone for 2 minutes, then in ethan...
Embodiment 2
[0059] Embodiment 2, the making of device of the present invention, comprises the following steps:
[0060] Step 1. Epitaxial material growth.
[0061] refer to figure 1 and figure 2 , the specific implementation of this step is as follows:
[0062] (101) On the double-sided polished sapphire substrate, grow a GaN buffer layer by MOCVD process;
[0063] (102) growing an intrinsic GaN layer on the GaN buffer layer;
[0064] (103) On the intrinsic GaN layer, a 20nm thick Al 0.3 Ga 0.7 N layer, intrinsic GaN layer and Al 0.3 Ga 0.7 2DEG is formed between N layers;
[0065] (104) in Al 0.3 Ga 0.7 On the N layer, a 2nm thick GaN cap layer is grown.
[0066] Step 2. Fabrication of source and drain electrodes.
[0067] refer to figure 1 and image 3 , the specific implementation of this step is as follows:
[0068] (201) Using PECVD equipment to protect the surface of the device with SiN coverage;
[0069] First, put the sample in acetone for 2 minutes, then in ethan...
Embodiment 3
[0087] Embodiment 3, the making of device of the present invention, comprises the following steps:
[0088] Step 1. Epitaxial material growth.
[0089] refer to figure 1 and figure 2 , the specific implementation of this step is as follows:
[0090] (101) On the double-sided polished sapphire substrate, grow a GaN buffer layer by MOCVD process;
[0091] (102) growing an intrinsic GaN layer on the GaN buffer layer;
[0092] (103) On the intrinsic GaN layer, a 20nm thick Al 0.3 Ga 0.7 N layer, intrinsic GaN layer and Al 0.3 Ga 0.7 2DEG is formed between N layers;
[0093] (104) in Al 0.3 Ga 0.7 On the N layer, a 2nm thick GaN cap layer is grown.
[0094] Step 2. Fabrication of source and drain electrodes.
[0095] refer to figure 1 and image 3 , the specific implementation of this step is as follows:
[0096] (201) Using PECVD equipment to protect the surface of the device with SiN coverage;
[0097] First, put the sample in acetone for 2 minutes, then in ethan...
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