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77results about How to "Good radiation resistance" patented technology

Full transparent AlGaN/GaN high electron mobility transistor and manufacturing method thereof

The invention discloses an AlGaN/GaN high electron mobility transistor taking transparent low-resistivity ZnO as a grate electrode, a source electrode and a drain electrode and a manufacturing method thereof, which relate to the field of microelectronic technology and mainly solve the problems that the conventional AlGaN/GaN high electron mobility transistor cannot be used in the field of full transparence and the conventional full transparent transistor has poor characteristics. The transistor sequentially comprises a GaN buffer layer, an intrinsic GaN layer, an Al0.3Ga0.7N layer, a GaN cap layer, the source electrode, the drain electrode and the gate electrode according to the growth sequence, wherein all the source electrode, the drain electrode and the gate electrode are made of a transparent ZnO material doped with Al2O3; an underlay is made of a sapphire with two polished sides; the source electrode, the drain electrode and the gate electrode are deposited on the GaN cap layer by a megnetron sputtering method; and Si+ ions are implanted into a source area and a drain area to assist an ohmic contact formation between the source area and the drain area. The full transparent AlGaN/GaN high electron mobility transistor has the advantages of full transparence and high characteristics, and can be used for electronic elements in an anti-radioactive circuit in the field of transparence.
Owner:云南凝慧电子科技有限公司

AlGaN/GaN high-electron-mobility transistor and manufacturing method thereof

The invention discloses an AlGaN/GaN high-electron-mobility transistor and a manufacturing method thereof, which relate to the technical field of microelectronics and mainly solve the problems of low working frequency and poor anti-irradiation performance of the transistor. The transistor sequentially comprises a GaN buffer layer, an intrinsic GaN layer, an Al0.3Ga0.7N layer, a GaN capping layer, a source electrode, a drain electrode and a grid electrode according to a growth sequence, wherein transparent ZnO is adopted by the grid electrode, an Ni metal bonding layer is evaporated below the ZnO grid electrode, and SiN protection layers are arranged at both sides. Al2O3 is doped in the ZnO grid electrode, and the length of the ZnO grid electrode is equal to the distance between the source electrode and the drain electrode. The manufacturing process of the transistor sequentially comprises the following steps of: firstly, growing an epitaxial material; then manufacturing the ZnO grid electrode; and finally, manufacturing the source electrode and the drain electrode at both sides of the ZnO grid electrode by utilizing a self-aligning method. The AlGaN/GaN high-electron-mobility transistor has the advantages of high frequency characteristic and good anti-irradiation characteristic and can be used as an electronic component in high-frequency and high-speed circuits.
Owner:云南凝慧电子科技有限公司

Anti-radiation wide spectrum fiber light source

The invention discloses an anti-radiation wide spectrum fiber light source. 980nm pump light can be coupled in an Er-doped fiber by a wavelength division multiplexer (WDM), and mixed light is output after the light is amplified through spontaneous emission (ASE) of erbium ions; the mixed light can generate reflected light after being processed by a second WDM and a reflecting mirror; the remnant 980nm pump light output from the second WDM can be converted to a voltage signal by a 980nm monitoring detector, and the voltage signal can act on a 980nm pump light source after being processed by a microprocessor and a digital constant current source; and an automatic temperature control circuit can ensure the 980nm pump light source to work at the temperature of 25 DEG C. The wide spectrum fiber light source provided by the invention utilizes the electrical signal output by the 980nm monitoring detector as a basis of feedback regulation and regulates drive current to control the stability of power and average wavelength of the output ASE light by using the negative feedback closed loop control principle, and thus the anti-radiation problem of the wide spectrum fiber light source can be well solved by using an active protective technology under the condition of not increasing the weight of the light source system.
Owner:BEIHANG UNIV

Ionization-irradiation-resistant active optical fiber for space

The invention relates to an ionization-irradiation-resistant active optical fiber for space. The ionization-irradiation-resistant active optical fiber comprises an active fiber core, an inner cladding layer, an outer cladding layer and a coating layer; the materials of the active fiber core comprise active reactive ions and silicon dioxide of a co-doping agent, wherein the active reactive ions are one or more of halides or oxides of rare-earth elements of which the atomic number is from 57 to 71, and the co-doping agent is one or more of germanium compounds, phosphorus compounds, aluminum compounds and fluorine compounds; cerium compounds are doped in the material of the active fiber core and the dosage concentration of the cerium compounds is between 2,000 and 10,000ppm; and cerium or fluorine can be also doped in the material of the inner cladding layer, wherein the dosage concentration of cerium ions is between 0 and 8,000ppm, and the dosage concentration of fluorine ions is between 0 and 1,000ppm. In the invention, the ionization-irradiation-resistant characteristics of the active optical fiber can be greatly improved according to test verification because the cerium is doped in the fiber core of the ionization-irradiation-resistant active optical fiber, and the problem of application restriction of the current active optical fiber in an irradiation environment is solved.
Owner:HUAZHONG UNIV OF SCI & TECH

Single event upset resistant SRAM (Static Random Access Memory) type FPGA (Field Programmable Gate Array) refresh circuit and refresh method

The invention relates to the field of spatial single event upset resistance of an FPGA (Field Programmable Gate Array), and particularly relates to a single event upset resistant SRAM (Static Random Access Memory) type FPGA refresh circuit and a refresh method, aiming at solving the problems such as high circuit complexity and controller instability as an existing SRAM type FPGA refresh circuit and a method utilize an external controller for achieving the reloading of a configuration command and configuration data. Two same memories are adopted, a complete configuration file is stored in a BOOT, the configuration file contains a functional module to be realized by a user and a refresh module for realizing refresh of the FGPA, an edited configuration file is stored in an SCRUB, after the FPGA loads the first memory, the refresh module is started to enter a refresh mode, and periodical refresh of the FPGA under normal working is achieved by periodically reading the configuration file in the SCRUB memory. The single event upset resistant SRAM type FPGA refresh circuit and the refresh method provided by the invention have the advantages that the power consumption for FPGA refresh and the circuit complexity are effectively reduced.
Owner:CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI

High-quality four-junction space solar cell and preparation method thereof

The invention discloses a high-quality four-junction space solar cell and a preparation method thereof. The high-quality four-junction space solar cell comprises a Ge substrate, and a Ge sub-cell, a GaInP nucleating layer, a GaInAs buffer layer, a first tunneling junction, a component gradient buffer layer, a DBR reflection layer, a GaInAs sub-cell, a second tunneling junction, an AlGaInAs sub-cell, a third tunneling junction and an AlGaInP sub-cell are sequentially arranged on the Ge substrate. Depletion layers are formed between base regions and emitter regions of the AlGaInAs sub-cell and the AlGaInP sub-cell, the base regions and the emitter regions are of band gap gradual change structures, and the band gap gradual change structures are introduced into the Al-containing sub-cell, so that the material quality of the depletion layers is improved, the minority carrier recombination rate of a main photon-generated carrier generation region is reduced, and the photon-generated carriercollection efficiency is improved. The gradual change band gap has the effect of an auxiliary back field, so that photon-generated carriers far away from the depletion layer drift towards the depletion layer, the Al component far away from the depletion layer enables the effective band gap of the Al-containing sub-cell to be wider, and higher open-circuit voltage can be obtained.
Owner:ZHONGSHAN DEHUA CHIP TECH CO LTD

65nm technology-based super-steep reverse-doping radiation-proof MOS field-effect tube

ActiveCN105514169AImprove radiation resistanceDoes not affect integrationSemiconductor/solid-state device detailsSolid-state devicesSubthreshold oscillationsThreshold voltage
The invention discloses a 65nm technology-based super-steep reverse-doping radiation-proof MOS field-effect tube, mainly solving the problems of increased OFF leakage current, threshold voltage drift and subthreshold oscillation amplitude degradation of a conventional 65nm MOS field-effect tube under a total dose radiation environment. The MOS field-effect tube comprises a P-type substrate (1) and an epitaxial layer (2) located on the substrate, wherein an isolation groove (3) is formed around a place above the epitaxial layer, a grid electrode (4) is arranged at the middle above the epitaxial layer, a source region (5) and a drain region (6) are arranged in the epitaxial layer between two side boundaries of the grid electrode and the inner boundary of the isolation groove, light-doping source-drain regions (7) are arranged in the epitaxial layer below the two side boundaries of the grid electrode, a channel is formed in an area between the two light-doping source-drain regions and right below the grid electrode, and a heavy-doping super-steep reverse-doping region (8) is arranged below the channel between the two light-doping source-drain regions. The 65nm technology-based super-steep reverse-doping radiation-proof MOS field-effect tube improves the total dose irradiation resistance of a device, and can be used for the preparation of large scale integrated circuits.
Owner:XIDIAN UNIV

High-elasticity anti-radiation nanofiber aerogel material and preparation method thereof

The invention relates to a high-elasticity anti-radiation nanofiber aerogel material and a preparation method thereof. The method comprises the steps of mixing and stirring tetraethoxysilane, phosphoric acid and water evenly for 1-24 h, then adding titanium dioxide nano powder, continuing stirring for 1-12 h, and conducting ultrasonic treatment to obtain composite hydrolysate; uniformly mixing a polyvinyl alcohol aqueous solution and the composite hydrolysate with water, conducting stirring for 1-12 hours, and then carrying out electrostatic spinning on the precursor solution to obtain a hybrid nanofiber membrane; carrying out heat treatment on the hybrid nanofiber membrane; adding the hybrid nanofiber membrane subjected to heat treatment, tetraethoxysilane, boric acid and aluminum chloride into water, adding a graphene oxide solution, and conducting stirring at a high speed to obtain a homogeneous dispersion liquid; and then sequentially subjecting the homogeneous dispersion liquid to freezing, freeze drying and post-treatment processes, so as to prepare the high-elasticity anti-radiation nanofiber aerogel material. The material prepared by the invention has high elasticity and also has excellent radiation resistance, temperature resistance and high-temperature heat insulation performance.
Owner:AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH

Nuclear power plant equipment monitoring system based on optical fiber Bragg grating sensing

A nuclear power plant equipment monitoring system based on optical fiber Bragg grating sensing comprises a light source, optical fiber Bragg gratings and copper/carbon coating optical fiber, wherein the optical fiber Bragg gratings are written on the copper/carbon coating optical fiber at intervals, or the optical fiber Bragg gratings are connected with the copper/carbon coating optical fiber, and the optical fiber Bragg gratings are attached on the surfaces of devices of pipelines, high-temperature and high-pressure containers and the like in a nuclear power plant and connected with an optical circulator through communication optical fiber. Light emitted from the light source is transmitted to the nuclear power plant through the optical circulator and the communication optical fiber, the light reflected by the optical fiber Bragg gratings reaches a photoelectric detector through the optical circulator and processed, then strain size generated by the optical fiber Bragg gratings can be confirmed, and accordingly the health conditions of nuclear power plant equipment are mastered. According to the nuclear power plant equipment monitoring system based on optical fiber Bragg grating sensing, wavelength division multiplexing or time division multiplexing can be adopted as the multiplexing mode, a distributed optical fiber Bragg grating sensor array is established, and the healthy monitoring of high-temperature and high-pressure equipment of the nuclear power plant is achieved.
Owner:XIAN UNIV OF TECH

MOSFET device and preparation method thereof

The invention provides an MOSFET device and a preparation method thereof. The MOSFET device comprises a substrate; a first n-type semiconductor layer, a p-type semiconductor layer and a second n-typesemiconductor layer are sequentially stacked on the substrate; the p-type semiconductor layer comprises a first p-type doped region and a second p-type doped region; the first p-type doped region is located on the two sides of the second p-type doped region, and the doping concentration of the second p-type doped region is higher than that of the first p-type doped region; the MOSFET device further comprises a source electrode which is arranged on the side, deviating from the p-type semiconductor layer, of the second n-type semiconductor layer and makes contact with the second n-type semiconductor layer and the second p-type doped region, a gate insulating layer and a gate; the gate insulating layer and the gate are sequentially stacked on the exposed surfaces of the second n-type semiconductor layer, the p-type semiconductor layer and the first n-type semiconductor layer; the MOSFET device further comprises a drain electrode which is arranged on one side, deviating from the first n-type semiconductor layer, of the substrate. A step-doped p region is formed on the p-type semiconductor layer, so that the breakdown voltage of the device is improved. The process is simple, and preparation is convenient.
Owner:SHENZHEN UNIV

Sandwiched parallel-connection PIN-type beta irradiation battery and preparation method thereof

The invention discloses a sandwiched parallel-connection PIN-type beta irradiation battery and a preparation method thereof. The invention mainly aims at solving problems of low energy conversion rate and low output power of current nuclear batteries. The battery comprises two PIN junctions connected in parallel and a beta radioactive source layer, wherein one PIN junction is positioned above the other. The lower PIN junction comprises, from bottom to top, an N-type ohmic contact electrode, an N-type highly doped 4H-SiC substrate, an N-type lowly doped epitaxial layer, a P-type highly doped epitaxial layer and a P-type ohmic contact electrode. The structural distribution of the upper PIN junction is opposite to that of the lower PIN junction. The beta radioactive source layer is sandwiched between the P-type ohmic contact electrodes of the upper and lower PIN junctions, such that full utilization upon high-energy beta particles can be realized. The irradiation battery provided by the invention has the advantages of large contact area between a radioactive source and a semiconductor, high nuclear raw material utilization rate, high energy collection rate, and large battery output voltage. The irradiation battery can perform long-lasting power supply for a small circuit, and can be used in power supply for occasions which need unmanned long-term powering, such as polar regions and deserts.
Owner:XIDIAN UNIV

Diamond semiconductor recoil proton telescope

The present invention discloses a diamond semiconductor recoil proton telescope. The diamond semiconductor recoil proton telescope comprises a penetrating type detector and a full-depletion type detector; a diamond detector is adopted as the full-depletion type detector; since the diamond detector has strong anti-radiation capacity, when the intensity of neutron flow is high, the diamond detector can have good anti-radiation capacity; and when the energy of neutrons is high, the energy of generated recoil protons is high, and after the recoil protons are deposited on the diamond detector, the energy of the recoil protons can be separated from the energy of backgrounds or other particles, and therefore, the recoil protons can be identified, and thus, background subtraction can be realized, the background subtraction is more thorough, and the accuracy of the measurement of a neutron source can be improved. The diamond semiconductor recoil proton telescope has strong anti-radiation capacity, so that a shielding body is not needed to shield radiation, and therefore, the recoil proton telescope provided by the present invention is of greater structural simplicity compared with a recoil proton telescope with poor anti-radiation performance in the prior art.
Owner:HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI

3D type PIN structure alpha irradiation battery and manufacturing method thereof

The invention discloses a 3D type PIN structure alpha irradiation battery and a manufacturing method of the 3D type PIN structure alpha irradiation battery. The 3D type PIN structure alpha irradiation battery and the manufacturing method mainly solve the problems that an existing alpha irradiation battery is low in energy conversion rate and output power. The manufacturing method includes the implementation steps of sequentially growing an N type lightly-doped 4H-SiC epitaxial layer and a P type highly-doped 4H-SiC epitaxial layer on a washed 4H-SiC substrate in an epitaxial mode, forming ohmic contact electrodes on the non-epitaxial back face of the P type highly-doped epitaxial layer and the non-epitaxial back face of the SiC substrate through deposition, conducting photoetching on the P type ohmic contact electrodes to obtain groove windows, conducting etching to obtain grooves, and placing alpha irradiation sources in the grooves to obtain the 3D type PIN structure alpha irradiation battery. The 3D type PIN structure alpha irradiation battery manufactured according to the method has the advantages that the contact area between the alpha irradiation battery and the alpha irradiation sources is large, the nuclear raw material utilization rate and the energy collection rate are high, and the battery output current and the battery output voltage are large; the 3D type PIN structure alpha irradiation battery can unceasingly supply power for miniature circuits or can supply power on the occasions where long-time power supply is needed but not unmanned.
Owner:XIDIAN UNIV

Parallel type PIN type beta irradiation battery and preparing method thereof

The invention discloses a parallel type PIN type beta irradiation battery and a preparing method thereof to mainly solve the problems that a current nuclear battery is low in energy converting ratio and output power. The parallel type PIN type beta irradiation battery comprises an upper PIN junction, a lower PIN junction and beta irradiation sources, wherein the upper PIN junction and the lower PIN junction are connected in parallel. The lower PIN junction comprises an N type ohmic contact electrode, an N type highly-doped 4H-SiC substrate, an N type lightly-doped epitaxial layer, a P type highly-doped epitaxial layer and a P type ohmic contact electrode from bottom to top in sequence, the top-to-bottom structural distribution of the PIN junction is the same as the bottom-to-top structural distribution of the lower PIN junction, a plurality of grooves are formed in each PIN junction, and the beta irradiation sources are placed in the grooves respectively. The two PIN junctions make contact with each other through the P type ohmic contact electrode, and the upper groove and the lower groove are in mirror symmetry and are communicated with each other. The parallel type PIN type beta irradiation battery has the advantages that the contact area between the irradiation sources and a semiconductor is large, the nuclear raw material utilization rate and the energy collection rate are high, and the output voltage of the battery is large, and the battery can provide power for a miniature circuit continuously or can provide power for polar regions, deserts and other areas.
Owner:XIDIAN UNIV

Sandwich parallel epitaxial gan pin type α irradiation cell and preparation method

The invention discloses a sandwich parallel-type epitaxial GaN PIN-type alpha irradiation battery and a manufacturing method thereof. The sandwich parallel-type epitaxial GaN PIN-type alpha irradiation battery and the manufacturing method thereof mainly solve the problems that an existing nuclear battery is low in energy transformation ratio and output power. The sandwich parallel-type epitaxial GaN PIN-type alpha irradiation battery comprises an upper PIN junction, a lower PIN junction and an alpha radioactive source layer, wherein the upper PIN junction and the lower PIN junction are connected in parallel. The lower PIN junction sequentially comprises a P-type ohmic contact electrode, a P-type highly-doped GaN epitaxial layer, an N-type highly-doped 4H-SiC substrate, an N-type low-doped SiC epitaxial layer and an N-type ohmic contact electrode from top to bottom, and the bottom-to-top structure of the upper PIN junction is identical to the top-to-bottom structure of the lower PIN junction. The alpha radioactive source layer is clamped between the P-type ohmic contact electrode of the upper PIN junction and the P-type ohmic contact electrode of the lower PIN junction, so that high-energy beta particles are fully utilized. The sandwich parallel-type epitaxial GaN PIN-type alpha irradiation battery and the manufacturing method thereof have the advantages that the contact area of a radioactive source and a semiconductor is large, the nuclear raw material utilization rate and the energy harvesting rate are high, and the output voltage of the battery is large; the battery can supply electricity to a small circuit enduringly or to a polar region, a desert and other occasions.
Owner:XIDIAN UNIV

High-temperature-resistant and corrosion-resistant rubber tube and preparing method thereof

The invention discloses a high-temperature-resistant and corrosion-resistant rubber tube and a preparing method thereof. Low-density polyethylene, ultra-high molecular weight polyethylene and macromolecular crosslinked polyethylene are used as raw materials, a lining film is prepared from chemical substances which have excellent bonding performance and are obtained after scientific compounding and vulcanization of a rubber pipe, and corona treatment is conducted on the bonding surface of the lining film and the bonding surface of the rubber pipe at the same time; glass fiber reinforced plastic reinforced fibers having the radiation protection performance are combined on the surface layer, so that the surface of the rubber pipe has the excellent radiation protection performance, and potential safety hazards caused by ionization radiation of a delivery pipeline are avoided; and finally the high-temperature-resistant and corrosion-resistant rubber tube which is provided with the firmly-bonded lining film, has the good radiation protection performance and can be used for delivering liquefied petroleum gas (LPG), liquefied natural gas (LNG) and extremely corrosive chemical solvent is prepared. The absorptivity to X rays and gamma rays in nuclear radiation and various neutrons of the hose can reach 97.5%-99.5%, and the binding force of the lining film and the rubber layer reaches 160-180 N/25mm.
Owner:ZHEJIANG HONGSHENG INTPROP OPERATION CO LTD
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