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Full photophobic copper-clad laminate and preparation method thereof

A copper-clad laminate, light-proof technology, applied in the field of electronic information, can solve the problems of accelerated product penetration, irritation, etc., and achieve the effect of excellent mechanical properties

Active Publication Date: 2011-06-08
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the perspective of demand, the advancement of light guide plate technology has increased the penetration rate of LEDBLU, and the increase in light transmittance will accelerate the popularization of lighting applications, but the price is still too high; but from the perspective of supply, the price competition of Japanese factories and the oversupply of Taiwanese factories will make LED BLU more popular. Prices will fall, and the price drop on the supply side will cause small profits but quick turnover to stimulate the market. If the demand continues to increase, it can relieve the pressure of oversupply and accelerate product penetration. Coupled with the heating up of energy issues, countries will formulate regulations and standards to promote LED. Industrial Development

Method used

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  • Full photophobic copper-clad laminate and preparation method thereof
  • Full photophobic copper-clad laminate and preparation method thereof
  • Full photophobic copper-clad laminate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] 1. Gluing formula (quality ratio):

[0064] Resin Dicyandiamide Dimethylimidazole Dimethylformamide Additive

[0065] 125 2.5 0.2 30 25

[0066] 2. Glue drying:

[0067] Oven temperature setting: 150-210℃

[0068] Prepreg gluing speed: 12-15m / min

[0069] 3. Prepreg control parameters:

[0070] Gel time: 115 seconds Resin content: 42%

[0071] Resin fluidity: 18-22% Volatile matter: 0.25%

[0072] 4. Layers of sheet metal arrangement: 8 pieces of 7628 prepreg (1.6mm)

[0073] 5. Platen parameters:

[0074] Vacuum degree: -0.097MPa

[0075] Pressure: 300-450psi

[0076] Hot plate temperature: 135-220°C, pressing time 90 minutes,

[0077] Curing time: 50 minutes.

[0078] 6. Substrate performance parameters

[0079]

[0080]

Embodiment 2

[0082] 1. Glue mixing formula (mass ratio):

[0083] Resin Dicyandiamide Dimethylimidazole Dimethylformamide Additive

[0084] 125 2.5 0.2 35 20

[0085] 2. Glue drying:

[0086] Oven temperature setting: 150-210°C

[0087] Prepreg gluing speed: 12-15m / min

[0088] 3. Prepreg control parameters:

[0089] Gel time: 120 seconds Resin content: 43.5%

[0090] Resin fluidity: 20.5% Volatile content: 0.25%

[0091] 4. Layers of sheet metal arrangement: 8 pieces of 7628 prepreg (1.6mm)

[0092] 5. Platen parameters:

[0093] Vacuum degree: -0.097MPa

[0094] Pressure: 300-450psi

[0095] Hot plate temperature: 135-220°C, pressing time 100 minutes,

[0096] Curing time: 60 minutes.

[0097] 6. Substrate performance parameters

[0098]

[0099]

Embodiment 3

[0101] 1. Glue mixing formula (mass percentage):

[0102] Resin Dicyandiamide Dimethylimidazole Dimethylformamide Additive

[0103] 125 3 0.3 30 30

[0104] 2. Glue drying:

[0105] Oven temperature setting: 150-210°C

[0106] Prepreg gluing speed: 12-15m / min

[0107] 3. Prepreg control parameters:

[0108] Gel time: 115sec Resin content: 45%

[0109] Resin fluidity: 20.5% Volatile content: 0.25%

[0110] 4. Layers of sheet metal arrangement: 8 pieces of 7628 prepreg (1.6mm)

[0111] 5. Platen parameters:

[0112] Vacuum degree: -0.099MPa

[0113] Pressure: 300-480psi

[0114] Hot plate temperature: 135-220°C, pressing time 95 minutes,

[0115] Curing time: 40 minutes.

[0116] 6. Substrate performance parameters

[0117]

[0118] The light transmittance of the epoxy glass cloth-based copper clad board substrate in the visible light region obtained in the above embodiments is less than 0.1%, and they all have excellent mechanical strength, mechanical properties,...

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Abstract

The invention belongs to the technical field of electronic information, in particular to a full photophobic copper-clad laminate and a preparation method thereof. In the preparation method, a novel photophobic additive is admixed in proper proportion in the glue mixing process, and an epoxy glass fabric-based copper-clad laminate with the light transmittance less than 0.1% in the range of visiblelights can be produced under the premises of not changing the original tooling or main raw materials and not changing the main performance parameters of the copper-clad laminate. The copper-clad laminate produced by the preparation method of the invention has favorable mechanical properties, and can be used for LED products and high-end printed wiring boards having higher light shielding requirements.

Description

technical field [0001] The invention belongs to the technical field of electronic information, and in particular relates to an epoxy glass cloth-based copper-clad laminate suitable for LED products and high-end printed circuit boards with high light-proof requirements and a preparation method thereof. Background technique [0002] At present, investment in the LED industry is a very hot key project, and countries around the world pay more attention to the R&D and production of LEDs. The LED industry has experienced many ups and downs since its development. Looking at the development trend of the LED industry, there is no doubt that obvious achievements have been made. China has a great advantage in developing the LED industry, especially LED display manufacturers. First, China has a huge market demand. Secondly, from the perspective of resources, China is rich in non-ferrous metal resources. Then there is the semiconductor lighting industry is a technology-intensive and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00H01L33/62B32B15/14B32B17/04B32B37/06B32B37/10B32B38/08C09J163/00C09J11/06C09J11/04
Inventor 冀翔张桂秋阚春节张东杨涛
Owner NANYA NEW MATERIAL TECH CO LTD
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