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Solderless integrated package connector and heat sink for led

A connector terminal and brazing technology, which is applied in the direction of assembling printed circuits with electric components, electric solid-state devices, semiconductor devices, etc., can solve problems such as difficult positioning and difficult to handle high-power LED packaging

Active Publication Date: 2010-07-28
LUMILEDS HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Different manufacturers have different capabilities for soldering LED packages to PCBs, making it difficult for some manufacturers to handle high power LED packages
[0006] Also, accurately positioning the package on the PCB is difficult because the package may be slightly misaligned on the PCB pad, which is still properly soldered to the PCB pad
Therefore, the light source will not be precisely positioned relative to the PCB

Method used

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  • Solderless integrated package connector and heat sink for led
  • Solderless integrated package connector and heat sink for led
  • Solderless integrated package connector and heat sink for led

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] figure 2 is a front view of the LED package 26 including the LED die 28 . In this example, four individual LED dies 28 are electrically interconnected to achieve the desired light output at a specified input current; however any number of LED dies may be interconnected in the same package.

[0034] In one embodiment, each LED die 28 is a GaN-based LED that emits blue light. A thin sheet of YAG phosphor on each die emits yellow-green light when excited by blue light. The combination of this yellow-green light and blue light transmission produces white light. Any other type of high power LED can be used and any other color can be produced. Suitable LEDs are commercially available from Philips Lumileds Lighting.

[0035] LED die piece 28 is installed on the base 30, in image 3 and Figure 4 better seen in . Submount 30 interconnects LED die 28 with metal trace layers, provides relatively large and robust cathode and anode pads to connect to the leads of the packag...

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PUM

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Abstract

Standard solderless connectors (36, 38) extend from a molded package body (42) supporting at least one high power LED die (28). The package (26) includes a relatively large metal slug (44) extending completely through the package body (42). The LED die (28) is mounted over the top surface of the metal slug (44) with an electrically insulating ceramic submount (30) in-between the LED die (28) and metal slug (44). Electrodes (32, 34) on the submount (30) are connected to the package connectors (36, 38). Solderless clamping means, such as screw openings (52, 54), are provided on the package (26) for firmly clamping the package on a thermally conductive mounting board. The slug in the package' thermally contacts the board to sink heat away from the LED. Fiducial structures (48, 50), e.g., holes, in the package precisely position the package on corresponding fiducial structures on the board. Other packages are. described that do not use a molded body.

Description

technical field [0001] The present invention relates to packaged light emitting diodes (LEDs) and in particular to an LED package that provides thermal dissipation of the LED to an external heat sink and uses standard solderless connectors for power supply. Background technique [0002] High power LEDs used for lighting generate a lot of heat that needs to be dissipated to an external heat sink. Generally speaking, prior art figure 1 The illustrated packaged LED comprises an LED die 10, a ceramic base 12 with electrodes bonded to the electrodes of the LED die, a metallic thermal conductor slug 14, a reflective cavity 16, electrodes connected to the base for soldering to a printed circuit board (PCB). ) on solderable surface mount leads 18, molded plastic body 20, and lens 22 glued to the body. [0003] A PCB (not shown) may have a metal body with an electrically insulating surface on which metal traces are formed. Metal traces can interconnect multiple LED packages, and m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H05K3/30H01L33/62H01L33/64
CPCH01L25/0753H01L33/642H05K3/308H01L33/62H01L2924/0002H01L2924/00
Inventor F·沃尔P·斯特伦伯格J·克梅特克M·法尔L·张
Owner LUMILEDS HLDG BV