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Method for manufacturing flash memory

A manufacturing method and flash memory technology, which are applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., to achieve the effects of increasing size reduction capability, reducing volume, and improving stability

Active Publication Date: 2010-08-11
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the problems encountered in the prior art to increase storage density by reducing device size, the present invention provides a method for producing flash memory with small volume and large storage capacity

Method used

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  • Method for manufacturing flash memory
  • Method for manufacturing flash memory
  • Method for manufacturing flash memory

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Embodiment Construction

[0020] Below, the present invention will be further described in conjunction with the accompanying drawings.

[0021] First, please refer to figure 1 , figure 1 It is a schematic flow chart of a flash memory manufacturing method of the present invention. It can be seen from the figure that a flash memory manufacturing method of the present invention includes the following steps: Step 51: providing a substrate; Step 52: etching a shallow trench in the substrate Groove, in order to maintain the verticality of the sidewall of the shallow trench, dry etching is used here for processing; Step 53: Perform the first ion implantation on the substrate to form a source region in the shallow trench, and After one ion implantation, perform annealing treatment, the temperature of the annealing treatment is between 1000°C and 1200°C, preferably, the temperature of the annealing treatment is 1100°C; step 54: forming in the shallow trench A first conductor layer, defining the first conducto...

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Abstract

The invention provides a method for manufacturing a flash memory, which comprises the following steps: providing a substrate; etching a shallow groove; carrying out ion implantation to form a source region; forming a first conductor layer to form a source; forming a second oxide layer and a storage medium layer, wherein the storage medium layer is made of nano silicon; forming a third oxide layer and a second conductor layer on the storage medium layer and the substrate, and etching the second conductor layer to form a first floating gate, a second floating gate and a control gate; forming a fourth oxide layer and a third conductor layer on the second conductor layer and the substrate, and etching the third conductor layer to form a first optional gate and a second optional gate; carrying out ion implantation to form a first drain region and a second drain region; and forming a first drain and a second drain on the first drain region and the second drain region. The flash memory manufactured by the method has the advantage of ingenious structural design and can effectively reduce the size of the flash memory, thereby enhancing the service efficiency of the substrate per unit area.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, and in particular to a flash memory manufacturing method. Background technique [0002] Flash memory has become a research hotspot in non-volatile memory due to its convenience, high storage density, and good reliability. Since the first flash memory product came out in the 1980s, with the development of technology and the storage needs of various electronic products, flash memory has been widely used in mobile and communication devices such as mobile phones, notebooks, handheld computers and U disks. , flash memory is a kind of non-volatile memory. Its operating principle is to control the switch of the gate channel by changing the critical voltage of the transistor or memory cell to achieve the purpose of storing data, so that the data stored in the memory will not be lost due to power interruption. Disappears, and flash memory is a special structure of electrically erasable and program...

Claims

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Application Information

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IPC IPC(8): H01L21/8247H01L27/115
Inventor 张博
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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