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Fabricating method for vertical field effect transistor

A technology of vertical field effect and fabrication method, applied in semiconductor/solid-state device manufacturing, electric solid-state device, semiconductor device, etc., can solve the problems of destroying the value of organic electronic engineering, high cost, and achieve excellent reproducibility, low manufacturing cost, The effect of excellent performance

Active Publication Date: 2010-08-25
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Such an approach is expensive and can destroy the value of organic electronics engineering

Method used

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  • Fabricating method for vertical field effect transistor
  • Fabricating method for vertical field effect transistor
  • Fabricating method for vertical field effect transistor

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Embodiment Construction

[0025] The present invention will now be described more fully with reference to the associated drawings, in which exemplary embodiments of the invention are disclosed.

[0026] As shown in FIG. 1 , a conventional organic field effect transistor may include adjacent source electrodes 2 and drain electrodes 6 on a substrate 1 . Gate electrode 5 and charge blocking layer 4 on source electrode 2 and drain electrode 6 . The current flow between the source electrode 2 and the drain electrode 6 can be controlled by the voltage applied to the gate electrode 5 . The length of the channel 3 formed of organic semiconducting material may be defined by the gap between the source electrode 2 and the drain electrode 6 . In order to obtain a large current, the length of the channel 3 is reduced to less than about 5 μm by a high-resolution method such as photolithography.

[0027] As shown in FIG. 2 , a conventional vertical organic field effect transistor may include a source electrode 2 an...

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Abstract

This invention provides a fabricating method for vertical field effect transistor which costs few money, in addtion, does not need process of photoetching and shadowing mask. In the vertical field effect transistor, a source electrode, an insulated layer and an intermittent grate electrode is formed on the substrate, then a charge carrier barrying layer, semiconductor material and a drain electrode are also formed. A gate electrode is formed by utilizing nm grain.

Description

[0001] This application is a divisional application of Chinese patent application 200510065522.0 filed on March 11, 2005, entitled "Vertical Field Effect Transistor, Its Fabrication Method, and Display Device Containing It". [0002] This application claims priority from European Patent Application No. EP040901027, filed March 11, 2004, and Korean Patent Application No. 10-2004-0052917, filed July 8, 2004, the entire contents of which are hereby incorporated Reference. technical field [0003] The invention relates to a field effect transistor, a display device containing it and a manufacturing method thereof. More specifically, the present invention relates to a vertical field effect transistor, a display device containing it and a method of manufacturing the same. Background technique [0004] Organic electronics engineering can be applied in display devices such as organic light emitting diodes, and can be applied to field effect transistors. Organic electronics enginee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/40G09F9/33H01L21/335H05B33/00H10K99/00
CPCH01L51/0017H01L51/057H01L51/0021H10K71/231H10K71/60H10K10/491H01L21/18H05B33/00B82Y40/00
Inventor M·雷德克J·费希尔A·马西
Owner SAMSUNG DISPLAY CO LTD