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Copper alloy material

A technology for alloy materials and plates, applied in the field of Cu alloy materials, can solve the problems of coarse precipitates, unsuitable for mass production, etc., and achieve the effects of excellent electrical conductivity and excellent workability

Inactive Publication Date: 2010-09-01
MICRO-STAR INTERNATIONAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the copper alloy proposed in this document is not suitable for mass production due to the problem of coarsening of precipitates when rolled at about 900°C.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0141] The Cu alloy having the chemical composition shown in Table 1 was vacuum-melted in a high-frequency melting furnace, and cast into a steel mold to obtain an ingot with a thickness of 50 mm, a width of 100 mm, and a height of 200 mm. As rare earth elements, simple substances of each element or mixed rare earth metals are added. For a part of the sample, the temperature change during the cooling process after casting is measured by a thermocouple installed on the inner wall of the mold, and the cooling curve at the center of the slab is obtained by using it together with the heat transfer analysis, and the average cooling rate before cooling to 600°C The speed is 2°C / s. In addition, in Comparative Example 36, it was cast into a sand mold and tested to reduce the cooling rate. In this case, the average cooling rate until cooling to 600°C was 0.2°C / s.

[0142] Regarding Test Nos. 1 to 35, the riser portion was cut and removed, and then, after heating to 900° C., hot forge...

Embodiment 2

[0151] Cu alloys having the chemical compositions (three types) shown in Table 2 were vacuum-melted in a high-frequency melting furnace, and cast pieces with a thickness of 30 mm and a width of 100 mm were obtained by continuous casting using a graphite mold directly connected to the holding furnace.

[0152] 〔Table 2〕

[0153]

[0154] Thereafter, each Cu alloy was processed and heat-treated by three different methods A, B, and C shown in Table 3, and thin strips of test numbers 41-49 were obtained.

[0155] 〔table 3〕

[0156]

[0157] For the thin strip thus produced, according to the aforementioned measurement method, the particle size of the precipitates and inclusions and the total number of particles per unit area N (mm -2 ), tensile strength TS (MPa), ductility El (%), electrical conductivity IACS (%) and bending workability B in the 90° bending test 90 . Further, from these values, the balance between tensile strength TS and electrical conductivity IACS (TS / IA...

Embodiment 3

[0160] The Cu alloy having the chemical composition shown in Table 4 was vacuum-melted in a high-frequency melting furnace, and cast into a steel mold to obtain an ingot with a diameter of 70 mm and a height of 170 mm. As rare earth elements, simple substances of each element or mixed rare earth metals are added.

[0161] 〔Table 4〕

[0162] Table 4

[0163]

[0164] The riser portion was cut and removed, and then hot forged to a diameter of 30 mm after heating to 900°C. In order to remove scale, the surface is ground, then heated to 250°C, and warm rolled. In addition, solution heat treatment was performed at 850° C. for 10 minutes, and cold rolling was performed until the diameter became 15 mm. Furthermore, an aging treatment was performed at 400° C. for 8 hours to obtain a wire rod.

[0165] For the wire rod produced in this way, according to the above-mentioned measuring method, the particle size of the precipitates and inclusions and the total number of particles pe...

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Abstract

A copper alloy material which contains, in terms of mass%, 0.01-2.5% titanium, 0.01-0.5% chromium, and 0.01-1%, excluding 1%, iron, the remainder being copper and impurities. The total number of those precipitates and inclusions present in the alloy material which have a particle diameter of 1 [mu]m or larger (N) and the particle diameter thereof (X) satisfy the equation (1). The relationship between the tensile strength (TS) and conductivity (IACS) of the copper alloy material satisfies the expression (2). The copper alloy material is characterized in that: when it is a plate material having a tensile strength (TS) of 600 MPa or lower, the bendability in a 90 DEG bending test (B90) satisfies the expression (3); when the copper alloy material is a plate material having a tensile strength (TS) exceeding 600 MPa, then the TS and B90 and the plate thickness (t) satisfy the expression (4); and when the copper alloy material is not a plate material, the ductility (E1) and the TS satisfy the expression (5). The material is excellent in strength, conductivity, and processability although it contains no element harmful to the environment.

Description

technical field [0001] The present invention relates to a Cu alloy material that does not use elements that adversely affect the environment, such as Pb, Cd, and Be. [0002] Examples of uses of the Cu alloy material include electrical and electronic components, safety tools, and the like. [0003] Examples of electrical and electronic components using Cu alloy materials include the following. In the field of electronics, connectors for computers, semiconductor sockets, optical pickups, coaxial connectors, IC checker pins, and the like are exemplified. In the field of communication, mobile phone parts (connectors, battery terminals, antenna parts), subsea repeater cases, connectors for switches, and the like are exemplified. In the automotive field, various electrical components such as relays, various switches, micromotors, fenders, and various terminals can be listed. In the field of medical and analytical instruments, there are medical connectors, industrial connectors, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22F1/00C22F1/08
CPCC22C9/00C22F1/08
Inventor 前原泰裕米村光治中岛敬治长道常昭
Owner MICRO-STAR INTERNATIONAL