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Epoxy resin composition for packaging semiconductors

A technology of epoxy resin and composition, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of reduced reliability of semiconductor devices, and achieve the effect of excellent flame retardancy and moisture-heat reliability

Inactive Publication Date: 2010-09-15
JIANGSU ZHONGPENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In addition, if semiconductor devices packaged with epoxy resins containing bromide and antimony compounds are stored at high temperatures, harmful substances will be produced due to thermal decomposition of these flame retardants to corrode semiconductor chips and reduce the reliability of semiconductor devices.

Method used

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  • Epoxy resin composition for packaging semiconductors
  • Epoxy resin composition for packaging semiconductors
  • Epoxy resin composition for packaging semiconductors

Examples

Experimental program
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Embodiment 1

[0018] Example 1. An epoxy resin composition for semiconductor encapsulation, the composition comprises: epoxy resin, phenolic resin curing agent, curing accelerator, inorganic filler; described phenolic resin curing agent refers to containing following general formula (I) The phenolic resin:

[0019]

[0020] Wherein: n=1-10, R is H, CH 3 or CF 3 .

Embodiment 2

[0021] Example 2. In the epoxy resin composition for semiconductor encapsulation described in embodiment 1, described R is H and CF 3 .

Embodiment 3

[0022] Example 3. In the epoxy resin composition for semiconductor encapsulation described in embodiment 1 or 2, described epoxy resin is the epoxy resin that structural formula is (II):

[0023]

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Abstract

The invention relates to an epoxy resin composition for packaging semiconductors. The composition contains epoxy resin, a phenolic resin curing agent, a curing promoting agent and inorganic filler. The composition is characterized in that the phenolic resin curing agent is phenolic resin containing the following formula (I), wherein n=1-10, and R is H, CH3 or CF3. The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits. The epoxy resin composition has no damage to the human body health and environments. Because the bromine compounds and antimonide are not contained, the epoxy resin composition is a green environment-protection product and is suitable for a low-pressure transfer forming process for molding, and the cured and formed semiconductor device has good flame retardant property and thermal-humidity reliability.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition for semiconductor encapsulation. Background technique [0002] Epoxy resin compositions have been widely and massively used for encapsulating semiconductor devices, such as transistors and integrated circuits, due to their excellent electrical properties, heat resistance and mechanical properties. According to the requirements of the electronics industry, epoxy resin compositions used in semiconductor devices must meet a certain level of flame retardant standards. Traditional epoxy resin compositions mainly use brominated compounds and antimony compounds to produce flame retardancy. Brominated diphenyldioxins or furans (PBDD / F) may be formed when the plastic compound with polybrominated biphenyl flame retardants is processed in an uncontrolled thermal process (referring to a temperature below 1200°C) or incineration. Both of these substances are carcinogen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/10C08K5/3445C08K5/17C08K5/50C08K5/3462C08K3/36H01L23/29
Inventor 张桂英周佃香宋迪单海丽
Owner JIANGSU ZHONGPENG NEW MATERIAL
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