Epoxy resin composition for packaging semiconductors

Abstract

The invention relates to an epoxy resin composition for packaging semiconductors. The composition contains epoxy resin, a phenolic resin curing agent, a curing promoting agent and inorganic filler. The composition is characterized in that the phenolic resin curing agent is phenolic resin containing the following formula (I), wherein n=1-10, and R is H, CH3 or CF3. The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits. The epoxy resin composition has no damage to the human body health and environments. Because the bromine compounds and antimonide are not contained, the epoxy resin composition is a green environment-protection product and is suitable for a low-pressure transfer forming process for molding, and the cured and formed semiconductor device has good flame retardant property and thermal-humidity reliability.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition for semiconductor encapsulation. Background technique [0002] Epoxy resin compositions have been widely and massively used for encapsulating semiconductor devices, such as transistors and integrated circuits, due to their excellent electrical properties, heat resistance and mechanical properties. According to the requirements of the electronics industry, epoxy resin compositions used in semiconductor devices must meet a certain level of flame retardant standards. Traditional epoxy resin compositions mainly use brominated compounds and antimony compounds to produce flame retardancy. Brominated diphenyldioxins or furans (PBDD / F) may be formed when the plastic compound with polybrominated biphenyl flame retardants is processed in an uncontrolled thermal process (referring to a temperature below 1200°C) or incineration. Both of these substances are carcinogen...

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Problems solved by technology

[0004] In addition, if semiconductor devices packaged with epoxy resins containing bromide and antimony compounds are stored at high temperatures, harmful substances will be produced due to thermal decomposition of these flame retardants to corrode semiconductor chips and reduce the reliability of semiconductor devices.

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