Epoxy resin composition for packaging semiconductors
A technology of epoxy resin and composition, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of reduced reliability of semiconductor devices, and achieve the effect of excellent flame retardancy and moisture-heat reliability
Inactive Publication Date: 2010-09-15
JIANGSU ZHONGPENG NEW MATERIAL
View PDF0 Cites 12 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] In addition, if semiconductor devices packaged with epoxy resins containing bromide and antimony compounds are stored at high temperatures, harmful substances will be produced due to thermal decomposition of these flame retardants to corrode semiconductor chips and reduce the reliability of semiconductor devices.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0018] Example 1. An epoxy resin composition for semiconductor encapsulation, the composition comprises: epoxy resin, phenolic resin curing agent, curing accelerator, inorganic filler; described phenolic resin curing agent refers to containing following general formula (I) The phenolic resin:
[0019]
[0020] Wherein: n=1-10, R is H, CH 3 or CF 3 .
Embodiment 2
[0021] Example 2. In the epoxy resin composition for semiconductor encapsulation described in embodiment 1, described R is H and CF 3 .
Embodiment 3
[0022] Example 3. In the epoxy resin composition for semiconductor encapsulation described in embodiment 1 or 2, described epoxy resin is the epoxy resin that structural formula is (II):
[0023]
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to an epoxy resin composition for packaging semiconductors. The composition contains epoxy resin, a phenolic resin curing agent, a curing promoting agent and inorganic filler. The composition is characterized in that the phenolic resin curing agent is phenolic resin containing the following formula (I), wherein n=1-10, and R is H, CH3 or CF3. The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits. The epoxy resin composition has no damage to the human body health and environments. Because the bromine compounds and antimonide are not contained, the epoxy resin composition is a green environment-protection product and is suitable for a low-pressure transfer forming process for molding, and the cured and formed semiconductor device has good flame retardant property and thermal-humidity reliability.
Description
technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition for semiconductor encapsulation. Background technique [0002] Epoxy resin compositions have been widely and massively used for encapsulating semiconductor devices, such as transistors and integrated circuits, due to their excellent electrical properties, heat resistance and mechanical properties. According to the requirements of the electronics industry, epoxy resin compositions used in semiconductor devices must meet a certain level of flame retardant standards. Traditional epoxy resin compositions mainly use brominated compounds and antimony compounds to produce flame retardancy. Brominated diphenyldioxins or furans (PBDD / F) may be formed when the plastic compound with polybrominated biphenyl flame retardants is processed in an uncontrolled thermal process (referring to a temperature below 1200°C) or incineration. Both of these substances are carcinogen...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/10C08K5/3445C08K5/17C08K5/50C08K5/3462C08K3/36H01L23/29
Inventor 张桂英周佃香宋迪单海丽
Owner JIANGSU ZHONGPENG NEW MATERIAL
PatSnap Eureka turns technology decisions into work you can execute. Powered by our Innovation Knowledge Graph, it runs expert workflows across engineering, life sciences, materials and intellectual property. Get your review-ready output in minutes.
