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Method for manufacturing printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, which can solve the problems of excessive photoresist ink and the inability to fully wash off photoresist ink, and achieve cost-saving effects

Inactive Publication Date: 2010-09-22
FULL TREASURE INT ENTERPRISE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Since the coating thickness of the current photoresist ink is about 30-35 μm, in order to fully dry the photoresist ink during pre-baking, it needs to be baked at a higher temperature or for a longer time. In addition, Coating photoresist ink with this thickness will leave more photoresist ink in the lotion when it is washed off by acid or alkaline lotion. After the lotion is used for a period of time, the photoresist ink will accumulate at the concentration becomes high, a new lotion will have to be replaced, otherwise the photoresist ink cannot be fully washed off

Method used

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  • Method for manufacturing printed circuit board

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Embodiment 1

[0023] The ink used in this embodiment is NSR-1000 FG4 green ink purchased from Taiwan Jingnai Co., Ltd., which consists of dipropylene glycol monomethyl ether <10% by weight, dipropylene glycol monomethyl ether acetate <15% by weight , epoxy acrylic resin < 35% by weight, high boiling point aromatic naphtha < 5% by weight, acetophenone derivative photosensitizer < 10% by weight and barium sulfate < 30% by weight, and the viscosity of the ink after stirring is 80Pda.

[0024] On the copper foil with a thickness of 0.16cm, use the ink-covering knife or scraper respectively at a speed of 15cm / min and a pressure of 5kg / cm 2 , Apply the above ink to the c-side of the copper foil (the surface for mounting parts) at an angle of 15 degrees so as to have a thickness of 15 μm, and apply the above-mentioned ink to a thickness of 14 μm on the surface opposite to the c-side (referred to as the s-side) . Pre-bake at a temperature of 72°C for 10 minutes, with a photomask with the desired p...

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Abstract

The invention provides a method for manufacturing a printed circuit board, which comprises the steps of: grinding a copper foil substrate to be processed and chemically processing the copper foil substrate to be processed; coating anticorrosive printing ink on the copper foil in the thickness of between 13 and 18 mu m; pre-baking the coated copper foil at the temperature of between 65 and 85 DEG C for 5 and 10 minutes; exposing the baked copper foil by using a photomask and then developing the exposed copper foil; and baking the obtained product at the temperature of 150 and 155 DEG C for 30 minutes. According to the method for manufacturing the printed circuit board, the printed circuit board can be obtained by coating thinner anticorrosive printing ink, so the use amount of the anticorrosive printing ink can be reduced; besides, the coated film is thinner, so the drying process can be complemented at a low temperature in a short time period, the cost is saved, and the effects of energy conservation and carbon reduction are achieved.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a printed circuit board capable of forming thinner resist ink. Background technique [0002] The manufacturing process of a general printed circuit board is to coat a photoresist ink on a substrate, and then expose it through a photomask with a desired circuit pattern, and then wash off the exposed part or the unexposed part with an acid or alkali washing solution. A circuit pattern is thereby formed. The base material generally uses copper foil, but in order to apply antifouling agent and photoresist ink on the bare copper surface to be soldered, in order to maintain its good solderability during storage and assembly process, the copper foil is usually degreased first. The cleaning step, followed by the formation of a protective layer (film) of organic matter and copper complexes on the cleaned copper surface, can avoid the oxidati...

Claims

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Application Information

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IPC IPC(8): H05K3/06
Inventor 桞志宏
Owner FULL TREASURE INT ENTERPRISE
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