Method for manufacturing printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, which can solve the problems of excessive photoresist ink and the inability to fully wash off photoresist ink, and achieve cost-saving effects
CN101841978AInactive Publication Date: 2010-09-22FULL TREASURE INT ENTERPRISE
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
FULL TREASURE INT ENTERPRISE
Publication Date
2010-09-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a method for manufacturing a printed circuit board, which comprises the steps of: grinding a copper foil substrate to be processed and chemically processing the copper foil substrate to be processed; coating anticorrosive printing ink on the copper foil in the thickness of between 13 and 18 mu m; pre-baking the coated copper foil at the temperature of between 65 and 85 DEG C for 5 and 10 minutes; exposing the baked copper foil by using a photomask and then developing the exposed copper foil; and baking the obtained product at the temperature of 150 and 155 DEG C for 30 minutes. According to the method for manufacturing the printed circuit board, the printed circuit board can be obtained by coating thinner anticorrosive printing ink, so the use amount of the anticorrosive printing ink can be reduced; besides, the coated film is thinner, so the drying process can be complemented at a low temperature in a short time period, the cost is saved, and the effects of energy conservation and carbon reduction are achieved.
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Description

technical field

[0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a printed circuit board capable of forming thinner resist ink. Background technique

[0002] The manufacturing process of a general printed circuit board is to coat a photoresist ink on a substrate, and then expose it through a photomask with a desired circuit pattern, and then wash off the exposed part or the unexposed part with an acid or alkali washing solution. A circuit pattern is thereby formed. The base material generally uses copper foil, but in order to apply antifouling agent and photoresist ink on the bare copper surface to be soldered, in order to maintain its good solderability during storage and assembly process, the copper foil is usually degreased first. The cleaning step, followed by the formation of a protective layer (film) of organic matter and copper complexes on the cleaned copper surface, can avoid the oxidati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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