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Epoxy silsesquioxane/epoxy resin hybridized glue for packaging photoelectric devices and preparation method thereof

A technology of silsesquioxane and epoxy resin, which is applied in the direction of epoxy resin glue, chemical instruments and methods, electrical components, etc., can solve the problem of difficulty in meeting the application requirements of optoelectronic device packaging, poor fatigue resistance and impact resistance, and adhesion Low strength and other problems, to achieve the effect of improving bond strength and elongation at break, good electrical properties, and small curing shrinkage

Inactive Publication Date: 2013-01-09
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional epoxy adhesives cannot meet the requirements of use after curing. After curing, there are shortcomings such as large internal stress, brittle texture, poor fatigue resistance, heat resistance, and impact resistance, as well as low peel strength and poor heat and humidity resistance. In addition, the high surface energy limits its application in some high-tech fields to a large extent, and silicone resin has attracted much attention due to its anti-rust, cold resistance, corrosion resistance, radiation resistance, ozone resistance and other properties, but the simple Silicone encapsulants have low bond strength, poor mechanical properties and high production costs, making it difficult to meet the application requirements of optoelectronic device encapsulation

Method used

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  • Epoxy silsesquioxane/epoxy resin hybridized glue for packaging photoelectric devices and preparation method thereof
  • Epoxy silsesquioxane/epoxy resin hybridized glue for packaging photoelectric devices and preparation method thereof
  • Epoxy silsesquioxane/epoxy resin hybridized glue for packaging photoelectric devices and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1. Synthesis of epoxy silsesquioxane:

[0032] a) Add 10 mL of organic solvent tetrahydrofuran, 25 mL of organosiloxane γ-(2,3 glycidoxy)propyltrimethoxysilane and 5 mL of deionized water into the reaction device.

[0033] b) 11 mL of formic acid catalyst was slowly added dropwise, the temperature was raised to 65° C., and the reaction was stirred for 6 h.

[0034] c) After removing water under reduced pressure, 5 mL of tetrahydrofuran was added, and the system continued to react for 2 h.

[0035] d) removing water and solvent under reduced pressure to obtain epoxy silsesquioxane.

[0036] e) Add trimethylchlorosilane, the volume ratio of which to epoxysiloxane is 0.01:1.

[0037] 2. Preparation of epoxy silsesquioxane / epoxy resin hybrid adhesive for photoelectric packaging:

[0038] a) Weigh 1.0 g of the above-mentioned product and 1.0 g of bisphenol A epoxy resin, and mix them uniformly at 45°C.

[0039] b) Add 0.02 g of triethylamine and mix well.

[0040] c) Ad...

Embodiment 2

[0044] 1. Synthesis of epoxy silsesquioxane:

[0045] a) 15 mL of organic solvent tetrahydrofuran, 28 mL of organosiloxane γ-(2,3 glycidoxy)propyltrimethoxysilane and 7 mL of deionized water were added to the reaction device.

[0046] b) 13 mL of formic acid catalyst was slowly added dropwise, the temperature was raised to 65° C., and the reaction was stirred for 6 h.

[0047] c) After removing water under reduced pressure, 6 mL of organic solvent tetrahydrofuran was added, and the system continued to react for 2 h.

[0048] d) removing water and solvent under reduced pressure to obtain epoxy silsesquioxane.

[0049] e) Add trimethylchlorosilane, the volume ratio of which to epoxysiloxane is 0.01:1.

[0050] 2. Preparation of epoxy silsesquioxane / epoxy resin hybrid adhesive for photoelectric packaging:

[0051] a) Weigh 0.4g of the above-mentioned product and 0.6g of bisphenol A epoxy resin, and mix them uniformly at 45°C.

[0052] b) Add 0.015 g of triethylamine and mix w...

Embodiment 3

[0057] 1. Synthesis of epoxy silsesquioxane:

[0058]a) 22 mL of organic solvent tetrahydrofuran, 34.86 mL of organosiloxane γ-(2,3 glycidoxy)propyltrimethoxysilane and 11.31 mL of deionized water were added to the reaction device.

[0059] b) 14.5 mL of formic acid catalyst was slowly added dropwise, the temperature was raised to 80°C, and the reaction was stirred for 6 h.

[0060] c) After removing water under reduced pressure, 8 mL of organic solvent tetrahydrofuran was added, and the system continued to react for 6 h.

[0061] d) removing water and solvent under reduced pressure to obtain epoxy silsesquioxane.

[0062] e) Add trimethylchlorosilane, the volume ratio of which to epoxysiloxane is 0.01:1.

[0063] 2. Preparation of epoxy silsesquioxane / epoxy resin hybrid glue for optoelectronic device packaging:

[0064] a) Weigh 0.3g of the above-mentioned product and 0.7g of bisphenol A epoxy resin, and mix them uniformly at 45°C.

[0065] b) Add 0.02 g of triethylamine ...

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Abstract

The invention relates to epoxy silsesquioxane / epoxy resin hybridized glue for packaging photoelectric devices and a preparation method thereof. The hybridized glue is prepared by mixing substrate resins, a curing agent and other components, wherein other components comprise the following materials in mass percentage: 12%-18% of modified epoxy silsesquioxane, 36%-42% of bisphenol A type epoxy resins, 30%-38% of polyamide, 5%-10% of N,N-diaminodiphenyl-methane and 0.5%-1.5% of triethylamine, and the structural formula of the modified epoxy silsesquioxane is shown in the specification, wherein Ris shown in the specification. The epoxy silsesquioxane synthesized in the method has high molecular weight, the maximum-average molecular weight reaches 1.1*10<6>, and the weight-average molecular weight reaches 1.21*10<6>. The prepared glue has the advantages of the epoxy silsesquioxane and the epoxy resins and has good heat resistance, cold resistance and corrosion resistance, high bonding performance, low curing contraction rate, good electrical performance, simple preparation process and easy operation of a preparation process, and excellent ultraviolet radiation resistance, chemical corrosion resistance and mechanical performance, wherein the electrical performance achieves the packaging requirements on the photoelectric devices.

Description

technical field [0001] The invention relates to a hybrid adhesive for photoelectric device packaging and a preparation method thereof, in particular to an epoxy silsesquioxane / epoxy resin hybrid adhesive for photoelectric device packaging and a preparation method thereof. Background technique [0002] With the development of electronic integration technology and printed circuit board technology, the density of electronic assembly has been greatly increased, electronic components have been reduced by tens of thousands of times, and the computing speed has become faster and faster. Under this high-frequency operating frequency, the working thermal environment of semiconductors moves rapidly to high temperature; at this time, the heat generated by electronic components accumulates and increases rapidly. The increase in temperature may be an important reason for the decline in the electrical insulation performance and mechanical properties of materials and the reduction in the l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09K3/10H01L31/0203
Inventor 贺英裴昌龙宋继中朱棣陈杰王均安
Owner SHANGHAI UNIV
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