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Amphiphilic block copolymer-modified epoxy resin and adhesives made therefrom

A technology of block copolymer and epoxy resin, applied in the direction of polyether adhesive, epoxy resin adhesive, adhesive type, etc., can solve the problems of less economic attractiveness and complicated preparation

Active Publication Date: 2012-09-05
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] While some of the aforementioned previously known diblock and triblock copolymers can be used to improve the toughness of epoxy resins, the preparation of these previously known block copolymers is complicated
These previously known block copolymers require multiple steps to be synthesized and are therefore less economically attractive from a commercial point of view

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 and Embodiment 2 and comparative example A

[0108] Part A: Preparation of Adhesive Samples

[0109] To each of the pre-adhesive mixtures prepared in Preliminary Example C above, 2E4MI vulcanization accelerator was added. The vulcanization accelerator was mixed by hand into this pre-adhesive mixture to produce the adhesive formulation of the present invention. Table 2 shows the amount of 2E4MI used in each mixture.

[0110] Table 2

[0111] Example

adhesive mix

compound#

Additive type

pre-adhesive

amount (g)

2E4MI catalysis

Agent (g)

Comparative Example A

1

Control (pre-adhesive

44.995

0.242

[0112]

Mixture #1)

Example 1

2

PEO-PBO-PEO Three

Block copolymer (pre-adhesive

Elixir Mix #2)

46.295

0.239

Example 2

3

PEO-PBO diblock

Copolymer (pre-bonded

agent mixture #3)

56.661

0.302

[0113] ...

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PUM

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Abstract

The invention relates to an amphiphilic block copolymer-modified epoxy resin and an adhesives made therefrom. The curable adhesive epoxy resin composition including (a) an epoxy resin; (b) an amphiphilic block copolymer containing at least one epoxy resin miscible block segment and at least one epoxy resin immiscible block segment; wherein the immiscible block segment comprises at least one polyether structure provided that the polyether structure of said immiscible block segment contains at least one or more alkylene oxide monomer units having at least four carbon atoms; in an amount such that when the epoxy resin composition is cured, the bond strength of the resulting cured epoxy adhesive resin composition increases compared to an epoxy resin composition without said amphiphilic polyether block copolymer; and (c) at least one curing agent. The amphiphilic block copolymer is preferably an all polyether block copolymer such as a PEO-PBO diblock copolymer or a PEO-PBO-PEO triblock copolymer.

Description

[0001] This application is a divisional application of the Chinese patent application with the application number 200580038535.7, the application date is November 2, 2005, and the invention title is "Epoxy resin modified by amphiphilic block copolymer and adhesive produced therefrom" . technical field [0002] The present invention relates to adhesive epoxy resin compositions modified with amphoteric polyether block copolymers to increase the fracture resistance or toughness and bond strength of the cured adhesive layer composition. Background technique [0003] Epoxy resins are generally cured with hardeners or curing agents, and when cured, the resins are well known for their thermal and chemical resistance. The cured epoxies also exhibit good mechanical properties but they have no toughness and tend to be very brittle when cured. The lack of toughness of the epoxy resin is especially true as the crosslink density or Tg of the epoxy resin increases. [0004] Recently, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J171/02
CPCC08G2261/126C09J163/00C09J171/02C08L63/00C08L71/02C08L2666/02C08L2666/22Y10T428/31515C08L23/00
Inventor H·Q·彭K·E·韦尔盖塞M·L·德特络夫
Owner DOW GLOBAL TECH LLC