Wafer clean method by wet method
A wafer and wet technology, applied in the field of wet wafer cleaning, can solve the problems such as the inability to fully exert the chemical cleaning ability, time and energy consumption, low working temperature, etc., to shorten the process time, reduce additional waste, avoid The effect of heat exchange
Inactive Publication Date: 2010-10-27
SHANGHAI HUA HONG NEC ELECTRONICS
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Problems solved by technology
Due to the low working temperature during this period, the cleaning ability of the liquid medicine cannot be fully exerted, and in extreme cases it is the invalid time
Therefore, both liquid medicine wasted, and time and energy were wasted
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[0029] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
[0030] If you change the existing process settings, first raise the temperature of the wafer to or close to the specified value before starting cleaning, so that the temperature of the wafer, the cleaning tank and the chemical solution are consistent to avoid heat exchange and keep the temperature of the chemical solution at the best The cleaning temperature realizes the best use of the liquid medicine, shortens the process time and improves the efficiency. Based on the function of the splash cleaning equipment itself, the above-mentioned purpose can be achieved without additional modification, that is, the hot nitrogen gas used for drying is first introduced for a period of time before spraying the chemical liquid and the motor starts to rotate. Due to the high temperature of nitrogen gas, which is about 40 to 80 degrees Celsius, the...
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The invention discloses a wafer clean method by a wet method, comprising the following steps: (1) a wafer is delivered into a clean trough; (2) a cabin door is closed; (3) hot nitrogen is introduced; the wafer is driven by an electric motor to start rotation until the temperature of the wafer achieves the designated temperature; (4) liquid medicine is delivered to the clean trough for cleaning through a nozzle; and the wafer is kept to rotate; (5) deionized water is sprayed into the liquid medicine by the nozzle after being cleaned to replace used liquid medicine; and the wafer is kept to rotate; (6) the hot nitrogen is introduced after the residual liquid medicine is replaced, and simultaneously the wafer is driven by the electric motor to accelerate rotation for drying; (7) the wafer is delivered out after drying. The method not only can improve utilization rate of the liquid medicine, reduce waste, but also can shorten process time, improve wet clean efficiency and realize energy conservation and emission reduction.
Description
technical field [0001] The invention relates to a semiconductor manufacturing process method, in particular to a wet wafer cleaning method. Background technique [0002] Such as figure 1 As shown, in the current splash-type wet cleaning equipment commonly used in the semiconductor field, the cleaning tank 6 is fixed by the base 3 and can be rotated under the drive of the motor 4. The working method is basically as follows: [0003] (1) The wafer 1 is sent into the cleaning tank 6; [0004] (2) The hatch is closed; [0005] (3) The chemical solution at a certain temperature (40-80 degrees Celsius) enters the cleaning tank 6 through the nozzle 2 for cleaning, and the wafer 1 starts to rotate under the drive of the motor 4; [0006] (4) After the chemical solution cleaning time is completed, the nozzle 2 sprays deionized water to replace the used chemical solution, and the wafer 1 keeps rotating; [0007] (5) After the replacement of the residual liquid medicine is complete...
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Inventor 陈华伦陈雄斌陈瑜熊涛罗啸
Owner SHANGHAI HUA HONG NEC ELECTRONICS