Lifting device and plasma processing equipment applying same
A lifting device, processing technology, applied in the field of microelectronics
Active Publication Date: 2012-03-07
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
This requires correspondingly processing a plurality of through holes or threaded holes on the horizontal adjustment plate 9 and the cylinder fixing plate 5 to install the above-mentioned fastening bolts 10 and leveling components 12, thus increasing the complexity of processing
[0010]Thirdly, the adjustment end of the above-mentioned leveling assembly 12 is set on the upper part of the horizontal adjustment plate 9, that is to say, the adjustment end of the above-mentioned leveling assembly 12 is located at the cylinder fixed Between the plate 5 and the electrostatic clamping device, however, in practical applications, the space below the electrostatic clamping device for installing the lifting device is very narrow, which makes the operating space for adjusting the above-mentioned leveling assembly 12 smaller, thereby giving The adjustment work brings inconvenience and increases the difficulty of adjustment
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[0030]In order to enable those skilled in the art to better understand the technical solution of the present invention, the lifting device provided by the present invention and the plasma processing equipment using the lifting device will be described in detail below with reference to the accompanying drawings.
[0031] Please also refer to Figure 3a and 3b , which shows a lifting device provided by a specific embodiment of the present invention. The lifting device includes a lifting part, a power transmission part, a level adjusting part and a pressure cylinder which are sequentially connected from top to bottom.
[0032] Wherein, the pressure cylinder is used as a power source for outputting motion mechanical energy to the power transmission part. It can be an air cylinder or a hydraulic cylinder, and the air cylinder 8 is selected in this embodiment.
[0033] The power transmission part is arranged between the pressure cylinder and the lifting part, including the liftin...
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The invention provides a lifting device, which is used for carrying semiconductor devices to move in the process of machining / processing of semiconductors, and comprises a pressure cylinder, a power transfer part, a lifting part, a horizontal adjusting part which is arranged between the lifting part and the power transfer part or between the power transfer part and the pressure cylinder. The horizontal adjusting part can quickly adjust the horizontality of the existing lifting device through an elastic component and an adjusting part. In addition, the invention also provides plasma processingequipment applying the lifting device. The lifting device and the plasma processing equipment have the advantages of simple structure, convenient and fast operation and the like.
Description
technical field [0001] The invention relates to the technical field of microelectronics, in particular to a lifting device and plasma processing equipment using the lifting device. Background technique [0002] With the advancement of science and technology, plasma processing enterprises are facing new technical challenges. Therefore, enterprises must continue to carry out technological innovation to adapt to new market demands. [0003] Plasma etching technology is a plasma processing technology that creates fine patterns on the surface of semiconductor devices such as wafers. In the etching process, maintaining the stability of wafer transmission between the transmission platform and the process platform is the basis for ensuring mass production of products. To this end, technicians complete the loading and unloading of wafers by means of a transfer system consisting of wafer lifting devices and manipulators. figure 1 Shown is the structure of a wafer lifting device. Th...
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IPC IPC(8): H01L21/677H01L21/00H01J37/32
Inventor 于岩
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD