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Method for manufacturing binary optical glass lens and packaging MEMS (Micro-electromechanical System) infrared detector

An infrared detector and binary optics technology, which is applied in the manufacture of microstructure devices, electric radiation detectors, decorative arts, etc., can solve the problems of low infrared transmittance, uncontrollable lens focal length, and reduced lens practicability, etc., to achieve The effect of high bonding strength, good airtightness and simple method

Active Publication Date: 2012-09-05
NANTONG XIANGYANG OPTICAL ELEMENT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing infrared focusing lens can be divided into two kinds of preparation methods: the first is to use optical material thermal reflow method to prepare, the problem of this method is that it is difficult to control the shape and size of the formed lens, which is completely determined by the properties of the material, The lens parameters cannot be designed arbitrarily, so that the focal length of the produced lens is uncontrollable, which greatly reduces the practicability of the lens
The second is to use multiple nested etchings of Ge materials to make diffractive lenses with binary optical properties. Although this method can precisely control the lens size and focus, it is not suitable for Ge because of its low infrared transmittance. Very good infrared lens material, but its transmittance to infrared is still too low

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  • Method for manufacturing binary optical glass lens and packaging MEMS (Micro-electromechanical System) infrared detector
  • Method for manufacturing binary optical glass lens and packaging MEMS (Micro-electromechanical System) infrared detector
  • Method for manufacturing binary optical glass lens and packaging MEMS (Micro-electromechanical System) infrared detector

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Embodiment 1

[0028] A method for manufacturing a binary optical glass lens and packaging a MEMS infrared detector, comprising the following steps:

[0029] The first step is based on the MEMS infrared detector (MEMS thermopile infrared detector is used here, and the thermopile uses multiple sets of thermocouples connected in series to measure temperature. According to the Seebeck effect, when there is a temperature difference between the two ends of the thermocouple , a voltage will be generated, and the greater the temperature difference between the hot and cold ends, the greater the output voltage. Multiple sets of thermocouples connected in series can improve the detection sensitivity of the thermopile. The hot end of the thermopile is in contact with the infrared absorption area, and the cold end is far away The infrared absorption area is insulated with heat-insulating materials, so that the infrared absorption area heats up due to the absorption of infrared rays, and a voltage is outp...

Embodiment 2

[0036] A method for manufacturing a binary optical glass lens and packaging a MEMS infrared detector, comprising the following steps:

[0037] The first step is to design the layout according to the wavelength of infrared rays detected by the thermopile infrared detector (2.2um). The graphics on the mask are concentric rings, and the radius of each ring of the m-layer mask is according to the formula Calculate,

[0038] In the second step, the reactive ion etching method is used to sequentially etch a specific pattern on the 4-inch Si wafer (in fact, three-dimensionally, it is a groove on the silicon wafer, and two-dimensionally, it is a pattern). The depths of the three etchings are respectively The pattern is 2.34um, 1.17um, 0.59um, the pattern is a stepped groove array etched, the height of each step is 0.59um, the total height of the steps is 4.1um, the silicon wafer is polished,

[0039] The 3rd step, the above-mentioned Si disc and the (4 inches) Pyrex7740 glass disc o...

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Abstract

The invention discloses a method for manufacturing and packaging an MEMS (Micro-electromechanical System) infrared detector by a binary optical glass lens, which comprises the following steps of: firstly, designing a binary optical mask plate according to a thermopile infrared detector to be packaged; secondly, carrying out nesting and etching three times on a silicon chip by using the binary optical mask plate, etching a step structure with binary optical diffraction property on the silicon chip; and thirdly, carrying out anodic bonding on the silicon chip and the glass chip to ensure that the glass chip and specific patterns form a vacuum sealing cavity, then heating for melting and forming glass, manufacturing a binary optical lens on the glass, then thermally annealing for eliminatinginternal stress of the glass, and removing a silicon mould. The lens glass chip and an infrared detector chip are aligned and bonded to realize the packaging of the infrared detector, and infrared rays are focused on an absorption region of the infrared detector. The optical lens manufactured by using the method can effectively improve the detection sensitivity of the thermopile infrared detector.

Description

technical field [0001] The invention relates to a method for manufacturing a MEMS (micro-electro-mechanical system) lens, in particular to a method for manufacturing a binary optical glass lens and packaging a MEMS infrared detector. Background technique [0002] With the continuous development of the semiconductor industry and MEMS (micro-electro-mechanical systems) technology, infrared thermal imagers with superior performance can be manufactured using advanced MEMS micro-processing technology. Uncooled thermopile infrared detectors are widely used in infrared thermal imaging cameras because of their low cost, simple process and high reliability, and they can work at room temperature. There is an infrared absorption area in the thermopile detector. Because it can effectively absorb infrared rays, the infrared absorption area of ​​the detector will heat up rapidly under the irradiation of infrared rays. The thermopile infrared detector is made up of several thermocouples co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/12B81C1/00
Inventor 尚金堂徐超张迪陈波寅柳俊文唐洁影黄庆安
Owner NANTONG XIANGYANG OPTICAL ELEMENT