Method for manufacturing binary optical glass lens and packaging MEMS (Micro-electromechanical System) infrared detector
An infrared detector and binary optics technology, which is applied in the manufacture of microstructure devices, electric radiation detectors, decorative arts, etc., can solve the problems of low infrared transmittance, uncontrollable lens focal length, and reduced lens practicability, etc., to achieve The effect of high bonding strength, good airtightness and simple method
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Embodiment 1
[0028] A method for manufacturing a binary optical glass lens and packaging a MEMS infrared detector, comprising the following steps:
[0029] The first step is based on the MEMS infrared detector (MEMS thermopile infrared detector is used here, and the thermopile uses multiple sets of thermocouples connected in series to measure temperature. According to the Seebeck effect, when there is a temperature difference between the two ends of the thermocouple , a voltage will be generated, and the greater the temperature difference between the hot and cold ends, the greater the output voltage. Multiple sets of thermocouples connected in series can improve the detection sensitivity of the thermopile. The hot end of the thermopile is in contact with the infrared absorption area, and the cold end is far away The infrared absorption area is insulated with heat-insulating materials, so that the infrared absorption area heats up due to the absorption of infrared rays, and a voltage is outp...
Embodiment 2
[0036] A method for manufacturing a binary optical glass lens and packaging a MEMS infrared detector, comprising the following steps:
[0037] The first step is to design the layout according to the wavelength of infrared rays detected by the thermopile infrared detector (2.2um). The graphics on the mask are concentric rings, and the radius of each ring of the m-layer mask is according to the formula Calculate,
[0038] In the second step, the reactive ion etching method is used to sequentially etch a specific pattern on the 4-inch Si wafer (in fact, three-dimensionally, it is a groove on the silicon wafer, and two-dimensionally, it is a pattern). The depths of the three etchings are respectively The pattern is 2.34um, 1.17um, 0.59um, the pattern is a stepped groove array etched, the height of each step is 0.59um, the total height of the steps is 4.1um, the silicon wafer is polished,
[0039] The 3rd step, the above-mentioned Si disc and the (4 inches) Pyrex7740 glass disc o...
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