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Process for manufacturing multilayer high-thermal conductivity mixed compression type aluminum base plate

A manufacturing process and technology for aluminum substrates, applied in manufacturing tools, metal processing equipment, details of milling machine equipment, etc., can solve the problems of easy generation of sharp edges and stress cracks, low chip removal efficiency, and large loss of gongs and knives. To achieve the effect of promoting promotion, improving quality and reducing processes

Inactive Publication Date: 2012-07-25
统赢软性电路(珠海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] A: One piece is produced at a time, and the production efficiency is low
And the maximum processing capacity of the gong machine is: 460*600mm, if the length exceeds 600mm, it cannot be processed
[0009] B: The maximum diameter of the gong cutter is 2.0mm, which is formed by cutting, and because of the design problem of the cutter, the chip removal efficiency is not high, and the heat dissipation effect is poor, which leads to the edge of the processed board and stress cracks.
[0010] C: The loss of gongs and knives is large, the processing fee is about 0.8 yuan / m, and the processing cost is high

Method used

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Experimental program
Comparison scheme
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Embodiment Construction

[0027] The present invention is described in further detail below with preferred embodiment:

[0028] The main content of the present invention is to change the concept of traditional CNC molding, and introduce a metal milling machine in the field of circuit board molding to manufacture and process multi-layer high thermal conductivity mixed-pressure aluminum substrates.

[0029] Technology of the present invention is:

[0030] A: The Defeng high-precision milling machine is selected to meet the production requirements of the finished size of the multi-layer high thermal conductivity mixed-pressure aluminum substrate + / -0.1mm, and its processing capacity meets the requirements of large-scale multi-layer high thermal conductivity mixed-pressure aluminum substrates. Production requirements, its main technical parameters are as follows:

[0031] Workbench area: 254*1370mm

[0032] Spindle speed: 5440rpm / min

[0033] Milling speed: 3-4m / min

[0034] Tool diameter: 6.0mm(min) ...

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PUM

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Abstract

The invention relates to a process for manufacturing a multilayer high-thermal conductivity mixed compression type aluminum base plate. The traditional multilayer high-thermal conductivity mixed compression type aluminum base plate is processed by the processing way of CNC (Computerized Numerical Control) which has complex program, low production efficiency, easy generation of burrs and stress cracks of a plate edge and high cost. The process for manufacturing and processing the multilayer high-thermal conductivity mixed compression type aluminum base plate by introducing a hardware milling machine comprises the following points of: A. adopting a Defeng milling machine, wherein the mode of the Defeng milling machine is universal turret type M4; B. directly confirming a processing size of the appearance according to a drawing; C. feeding plates in a clamping way; D. adopting a hardware milling machine which is a special metal processing main shaft and can bear larger cutting force; E.cutting and moulding by a smallest milling cutter with the diameter of 6.0mm; and F. having little loss of the milling cutter. The invention has the advantages of reduced procedure and production cost, improved quality and efficiency, saved energy, completion of manufacture of a large-size production plate, wide application range and beneficial popularization.

Description

technical field [0001] The invention relates to the field of electronic circuit production, in particular to a manufacturing process of a multi-layer high thermal conductivity mixed-pressure aluminum substrate. Background technique [0002] The existing multi-layer high thermal conductivity mixed-pressure aluminum substrate adopts CNC processing method for forming processing. The main manufacturing processes are as follows: [0003] A: The shape of the multi-layer high thermal conductivity mixed-pressure aluminum substrate to be formed is converted into a tape that can be recognized by the CNC machine through a computer software program, and the CNC machine is called out to produce the tape; [0004] B: First adjust the program to drill the positioning hole, and then position the high thermal conductivity mixed-pressed aluminum substrate to be formed on the work surface. Due to the insufficient torque of the main shaft of the gong machine, only one piece can be stacked at a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23C3/00
Inventor 阙民辉
Owner 统赢软性电路(珠海)有限公司