Process for manufacturing multilayer high-thermal conductivity mixed compression type aluminum base plate
A manufacturing process and technology for aluminum substrates, applied in manufacturing tools, metal processing equipment, details of milling machine equipment, etc., can solve the problems of easy generation of sharp edges and stress cracks, low chip removal efficiency, and large loss of gongs and knives. To achieve the effect of promoting promotion, improving quality and reducing processes
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[0027] The present invention is described in further detail below with preferred embodiment:
[0028] The main content of the present invention is to change the concept of traditional CNC molding, and introduce a metal milling machine in the field of circuit board molding to manufacture and process multi-layer high thermal conductivity mixed-pressure aluminum substrates.
[0029] Technology of the present invention is:
[0030] A: The Defeng high-precision milling machine is selected to meet the production requirements of the finished size of the multi-layer high thermal conductivity mixed-pressure aluminum substrate + / -0.1mm, and its processing capacity meets the requirements of large-scale multi-layer high thermal conductivity mixed-pressure aluminum substrates. Production requirements, its main technical parameters are as follows:
[0031] Workbench area: 254*1370mm
[0032] Spindle speed: 5440rpm / min
[0033] Milling speed: 3-4m / min
[0034] Tool diameter: 6.0mm(min) ...
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