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Double-arm transmission robot applied to high-cleanliness environment

A technology with high cleanliness and robotics, applied in the direction of conveyor objects, manipulators, transportation and packaging, etc., can solve difficult problems, achieve high efficiency requirements, and meet the effect of cleanliness requirements

Inactive Publication Date: 2010-12-08
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, for the more difficult dual-arm transfer robot used for large-diameter silicon wafer transfer and fixed-point placement in a high-cleanliness environment, there are no other reports in China except for the content described in this patent.

Method used

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  • Double-arm transmission robot applied to high-cleanliness environment
  • Double-arm transmission robot applied to high-cleanliness environment
  • Double-arm transmission robot applied to high-cleanliness environment

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Embodiment Construction

[0039] The present invention will be further described below in conjunction with accompanying drawing:

[0040] Referring to the accompanying drawings, a dual-arm robot for large-diameter semiconductor wafer transfer and high-precision fixed-point placement in a high-clean environment includes FORK combination 1; R-axis left mechanical arm combination 2; R-axis right mechanical arm Combination 3; R-axis left arm drive device combination 4; R-axis right arm drive device combination 5; T-axis combination 6; Z-axis guide rail mechanism combination 7; Z-axis screw mechanism combination 8; Z-axis drive device combination 9; large column Combination 10; Case supporting mechanism combination 11. Among them, FORK combination 1 includes trachea joint 12, FORK adjustment chuck combination 13, air path sealant 14, and FORK 15; R-axis left mechanical arm combination 2 (R-axis right mechanical arm structure is similar) includes R-axis big arm active synchronous transmission Wheel 16, R-ax...

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Abstract

The invention relates to a double-arm transmission robot applied to a clean environment, which is used for the transmission and high-precision positioning placement of a large-diameter semiconductor silicon wafer in a high-cleanliness environment. The double-arm transmission robot is in the structural form of R-theta type and has the working principle of a space structure based on a cylindrical coordinate system and the characteristic of independent control of all motion shafts. The double-arm transmission robot mainly comprises an R-axis left arm mechanism, an R-axis right arm mechanism, a T-axis rotating mechanism, a Z-axis lifting mechanism, and the like and seals the pollution of a drive mechanism on an external environment by adopting a special seal device so as to be suitable for the high-cleanliness production environment requirement.

Description

technical field [0001] The invention relates to a dual-arm transmission robot for the transmission, handling and high-precision fixed-point positioning of sheet products such as large-diameter semiconductor silicon wafers (IC chips) and flat panel displays in the high-cleanness environment of semiconductor VLSI manufacturing. Background technique [0002] The dual-arm transfer robot used to transfer silicon wafers in a high-clean environment is of great significance for ensuring the quality of IC products and improving the efficiency of IC production lines. It is one of the important equipment for the manufacturing technology of VLSI. [0003] At present, several universities and research institutes in China have successively developed the principle prototype of the single-arm robot for silicon wafer transfer. However, there are no other domestic reports on the more difficult dual-arm transfer robot used for large-diameter silicon wafer transfer and fixed-point placement in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677B25J9/02B25J13/00B25J19/00
Inventor 刘延杰吴明月荣伟彬孙立宁
Owner HARBIN INST OF TECH
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