Low-temperature hot-seal adhesive and preparation method thereof
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A low-temperature heat-sealing and resin technology, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems that heat-sealing glue cannot meet the requirements, and achieve the effects of high yield, reasonable process, and easy operation
Active Publication Date: 2010-12-15
JIANGSU ZHONGJIN MATAI MEDICINAL PACKAGING
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Problems solved by technology
For the case where the packaged medicine is prone to denaturation under high temperature conditions, this type of heat-sealing adhesive cannot meet the requirements
Method used
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preparation example Construction
[0035] A kind of preparation method of above-mentioned low-temperature heat-sealing glue, the technological step of preparation is as follows,
[0036] (1) Put the solvent into the reaction kettle and fully stir;
[0037] (2) Keep stirring, put the auxiliary resin, the main resin, and the surface modifier into the reaction kettle in turn, and raise the temperature to below 60°C, and keep stirring at the temperature for about 1.5 hours;
[0038] (3) Keep stirring, put the plasticizer into the reaction kettle, and stir for 15 to 25 minutes;
[0039] (4) Cooling and filtering to obtain low-temperature heat-sealing glue.
Embodiment 1
[0041] Example 1: In a 1000-liter small reactor with stirring and reflux, add 745 kg of mixed solvents such as butanone and ethyl acetate at 50 ° C; keep stirring, first add 50 kg of vinyl chloride copolymer resin; add after 20 minutes 180kg of plastic polyurethane resin and 20kg of polyester resin; after stirring and refluxing for 1.5 hours, add 5kg of polyol ester, after stirring and refluxing for 20 minutes, cool and filter.
Embodiment 2
[0042] Example 2: In a 1000-liter reactor with stirring and reflux, add 720 kg of mixed solvents such as butanone, butyl acetate, and isopropanol at 50 ° C; keep stirring, and add 60 kg of epoxy resin first; After 20 minutes, add 150 kg of plastic acrylic resin and 50 kg of plastic polyurethane resin; stir and reflux for 1.5 hours, then add 15 kg of citrate, stir and reflux for 15 minutes, then cool and filter.
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Abstract
The invention discloses a low-temperature hot-seal adhesive, which consists of the following raw materials in percentage by weight: 10 to 30 percent of main resin, 5 to 15 percent of auxiliary resin, 0.2 to 3 percent of plasticizer, 0.2 to 1 percent of surface modifier and 60 to 80 percent of solvent. The main resin is one or two of a polyester resin, a plastic polyurethane resin and a plastic acrylic resin with the molecular size of between 15,000 and 25,000; and the auxiliary resin is one of a vinyl chloride copolymer resin, a plastic polyurethane resin and an epoxy resin with the molecular size of between 10,000 and 20,000. The low-temperature hot-seal adhesive has the advantages that: 1, the adhesive has low-temperature hot-seal property, and the hot-seal strength is not lower than that of a common hot-seal adhesive for an aluminum foil; and 2, the adhesive has hot-seal diversification, can seal PVC, PC and PS sheets, and meets the requirement on hot-seal strength.
Description
technical field [0001] The invention relates to an inner layer adhesive used for covering aluminum foil for blister packaging, in particular to a low-temperature heat-sealing adhesive and a preparation method thereof. Background technique [0002] The existing commonly used covering aluminum foil for blister packaging is based on pure aluminum foil, and a protective layer and a printing layer or only a protective layer are attached to the outer surface of the aluminum foil; a printing layer and a heat-sealing adhesive layer are attached to the inner surface of the aluminum foil layer. Or only heat seal adhesive layer. The sealing temperature of this aluminum foil heat-sealing adhesive is 150°C, and generally only PVC sheets can be sealed. For the case where the packaged medicine is prone to denaturation under high temperature conditions, this type of heat-sealing adhesive cannot meet the requirements. Contents of the invention [0003] The technical problem to be solved ...
Claims
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Application Information
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