Cyanide-free copper electroplating method

A cyanide-free copper plating and electroplating solution technology, which is applied in the field of electrochemical copper plating, can solve problems such as difficult maintenance of the solution, poor bonding force of the plating layer, cumbersome operation, etc., to protect the environment and personal safety, improve the bonding force of the copper plating layer, The effect of simple process operation

Inactive Publication Date: 2010-12-15
河南平原光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, due to the improvement of environmental protection requirements, many cyanide-free copper plating processes have been introduced, but due to

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Embodiment 1: Use deionized water and electroplating grade chemical raw materials, adjust the pH value with HEDP and KOH, the pH value is 9, there is air stirring or cathode movement, charged into the tank, and the current density is 0.2A / dm 2 ; In the process of copper ion complexation in the electroplating solution, HEDP is used to complex the copper ions in the electroplating solution, and then EDTA is used to assist the complexation of the remaining copper ions in the electroplating solution. The rest of the operation process is the same as the conventional operation mode, and will not be repeated here.

Embodiment 2

[0013] Embodiment 2: Use deionized water and electroplating grade chemical raw materials, adjust the pH value with HEDP and KOH, the pH value is 10, there is air stirring or cathode movement, charged into the tank, the current density is 2A / dm 2 ; In the process of copper ion complexation in the electroplating solution, HEDP is used to complex the copper ions in the electroplating solution, and then EDTA is used to assist the complexation of the remaining copper ions in the electroplating solution. The rest of the operation process is the same as the conventional operation mode, and will not be repeated here.

Embodiment 3

[0014] Embodiment 3: Use deionized water and electroplating grade chemical raw materials, adjust the pH value with HEDP and KOH, the pH value is 11, there is air stirring or cathode movement, charged into the tank, the current density is 2.5A / dm 2 ; In the process of copper ion complexation in the electroplating solution, HEDP is used to complex the copper ions in the electroplating solution, and then EDTA is used to assist the complexation of the remaining copper ions in the electroplating solution. The rest of the operation process is the same as the conventional operation mode, and will not be repeated here. :

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PUM

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Abstract

The invention discloses a cyanide-free copper electroplating method which comprises the following steps of: during the complexation process of copper ions in an electroplate liquid, firstly, complexing the copper ions in the electroplate liquid by using HEDP (Hydroxy Ethidene Phosphonic Acid); then, complexing the residual copper ions in the electroplate liquid by using EDTA (Ethylene Diamine Tetraacetic Acid) in an auxiliary mode. The technical scheme comprises the following steps of: complexing the copper ions in the solution by using a proper complexing agent, and activating a metal matrix; complexing the residual copper ions in the solution by using a proper auxiliary complexing agent, increasing cathodic polarization so that the copper ions are more difficult to discharge to effectively prevent replacement precipitation, and increasing the bonding force of an electroplating layer. The invention has the advantages of obviously increased bonding force of copper electroplated layer, simple technological operation and convenient electroplate liquid maintenance.

Description

technical field [0001] The invention relates to a method for cyanide-free copper plating, which belongs to the field of electrochemical copper plating. Background technique [0002] For a long time, copper plating has been a copper plating process using cyanide. Due to the high toxicity of cyanide, there is a huge threat to the environment and even personal safety. In recent years, due to the improvement of environmental protection requirements, many cyanide-free copper plating processes have been introduced, but due to problems such as poor bonding of the coating, difficult solution maintenance, and cumbersome operations, they are rarely used in actual production. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a cyanide-free copper plating method with strong coating binding force, simple bath maintenance and easy operation. [0004] In order to solve the above-mentioned technical problems, the present inventio...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/04
Inventor 刘书强任清
Owner 河南平原光电有限公司
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