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Material and production process for producing copper-clad plate

A production process and technology of copper clad laminates, applied in the field of materials and production processes for the production of copper clad laminates, to achieve the effect of eliminating air bubbles and uniform resin flow

Active Publication Date: 2012-08-08
JIANGSU SUNYUAN AEROSPACE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Although the preparation process of copper-clad laminates is relatively mature, brominated epoxy resin systems are generally used as flame retardants in the prior art, and brominated compounds are easily burned and decomposed at high temperatures to produce dioxin-like toxic substances

Method used

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  • Material and production process for producing copper-clad plate
  • Material and production process for producing copper-clad plate
  • Material and production process for producing copper-clad plate

Examples

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Embodiment 1

[0029] The present invention is a material for producing copper clad laminates, the material includes glass fiber cloth, epoxy resin and copper foil, the epoxy resin is phosphorus / nitrogen epoxy resin, and inorganic resistive The flame retardant includes aluminum hydroxide powder and silicon powder in the inorganic flame retardant; among them, the glass fiber cloth is woven from untwisted open fiber glass fiber.

Embodiment 2

[0031] On the basis of Example 1, in order to ensure the quality of the copper clad laminate and make it have better flexibility, a preferred embodiment of the present invention is to control the particle size of aluminum hydroxide powder and silicon powder to 3000 mesh, Promptly select a kind of superfine aluminum hydroxide powder and supersoft silicon powder for use, all the other are identical with the technical scheme of embodiment 1.

Embodiment 3

[0033] On the basis of Example 2, because aluminum hydroxide has the advantages of good thermal stability, non-toxicity, no corrosive gas, less smoke generation, etc., and it is rich in resources and cheap in price, the preferred embodiment of the present invention also has the following advantages: , the weight percentage content of the inorganic flame retardant in the epoxy resin is 25%, the weight percentage content of the aluminum hydroxide powder in the inorganic flame retardant is 75%, and all the other technical schemes are identical with embodiment 2.

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Abstract

The invention discloses a material for producing a copper-clad plate, which comprises a glass cloth, an epoxy resin and a copper foil, wherein the epoxy resin is a phosphorus / nitrogen epoxy resin, an inorganic flame retardant is added in the epoxy resin, and the inorganic flame retardant contains aluminum hydroxide powder and silicon powder; and the glass cloth is formed by weaving untwisted opened glass fibers. By using the superfine aluminum hydroxide powder and the super soft silicon powder as flame retardant materials in the epoxy resin in the copper-clad plate material to replace brominated resin and other halogens used as the flame retardant materials in the prior art, the invention solves the problem that dioxin substances harmful to humans and environment are produced in the burning process of bromides because the flame retardant system of a common copper-clad plate is a bromine-containing resin system.

Description

technical field [0001] The invention relates to a copper clad laminate, in particular to a material and a production process for producing a copper clad laminate. Background technique [0002] Copper clad laminates are mainly used to make printed circuit boards for various military electronic equipment, communication equipment, computers, automotive electronics, household appliances and other manufacturing industries. With the development of the global electronic information industry, the demand for copper clad laminates has grown rapidly and entered a period of rapid development. At the same time, the domestic electronic information industry has grown synchronously, and the growth rate of the copper clad laminate market has exceeded the world average growth rate, showing a strong growth momentum for many years. [0003] With the development of copper clad laminate technology and the improvement of people's living standards, the requirements for electronic products are gett...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08K13/04C08K7/14C08K3/22C08K3/02B32B15/14B32B17/02B32B17/10B32B27/18B32B27/38H05K1/03
Inventor 王忠义陈辉钱佳鑫袁建锭李金生袁晓丹
Owner JIANGSU SUNYUAN AEROSPACE MATERIAL
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