LED light-emitting module processing method

Abstract

The invention relates to an LED light-emitting module processing method which comprises the steps of: respectively welding at least one LED and two or more conductive terminals on a circuit substrate of a light source module to form electrical connection, integrally forming an accommodating cup part outside the circuit substrate in a covering and ejecting mode and respectively forming openings for exposing the LEDs and the conductive terminals in the upper side and the lower side of the accommodating cup part; and carrying out secondary package on the surfaces of the tops of the accommodating cup part and the LEDs in a covering and ejecting mode to form a lens with preset shape, wherein the lens can be directly secondarily packaged and formed on the accommodating cup part and the LEDs to ensure that the inside of the lens does not have clearance so that the phenomena of refraction and light attenuation because lights passes through different media can be decreased for improving the intensity of illumination of the LEDs through projecting bright lights towards the lens and then being capable of ensuring that the light source module generates a planar light source uniformly and outwards emitting lights.

Description

technical field [0001] The invention relates to a process method of an LED light-emitting module, in particular, the lens can be encapsulated and molded on the surface of the container cup and the light-emitting diode by the method of coating injection, so that there is no gap inside, thereby reducing the number of light-emitting diodes. The method of refraction and light attenuation caused by light passing through different media. Background technique [0002] There are quite a lot of types of general lamps and the types of light they produce. Take the Light Emitting Diode (LED), which is common in the market and widely used in various fields, as an example. It not only has good photoelectric conversion efficiency, fixed wavelength, and light quantity , Adjustable light quality and other characteristics, and can achieve the advantages of small size, low heat generation and long service life, and it is more suitable for all kinds of downlights, headlights or table lamps and ...

AI Technical Summary

Problems solved by technology

[0005] 1. The existing colloid E packaging is mainly used to protect the chip A and to transmit the light and heat generated by the chip A to the outside as much as possible. However, when the light generated by the chip A emits light and enters the lens F through the colloid E, the first Secondary refraction, and when the light passes through the lens F, it will produce double refraction, so some companies use colloid-free packaging, and directly use the lens F made of glass material as a jacket to protect the colloid E from aging and affecting light transmittance, etc. However, because there is a certain gap between the chip A and the lens F, the light will still cause refraction and light attenuation when passing through different air media.

[0006] 2. When the existing chip A is surface-mounted (SMT) with the preset circuit substrate, it needs to pass through a tin furnace at a high temperature of 250°C to 300°C, so that the colloid E will age when it is heated, and its heat resistance is not good, which is not conducive to the surface In addition to the adhesive welding operation, the overall optical quality of the lens F will also be slightly shrunk due to overheating, and the curvature will change, resulting in a decrease in the illumination of the bright light projected from the chip A towards the lens F, and a flat light source that emits uniform light outwards cannot be produced. Wait for the deletion to occur

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