Semiconductor assembly and manufacturing method thereof
A manufacturing method, semiconductor technology, applied in the field of its combination and its manufacture, insulated gate bipolar transistor components, can solve problems such as chip bending and deformation
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[0082] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and methods of the semiconductor component and its manufacturing method proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its effect is described in detail below.
[0083] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. For convenience of description, in the following embodiments, the same elements are denoted by the same numbers.
[0084] Figure 1D and Figure 1D-1 They are respectively schematic cross-sectional views of a planar field effect transistor and a trench field effect transistor according to an embodiment of the p...
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