Curable resin composition for encapsulating optical semiconductor and cured product thereof

Abstract

The invention aims to provide a curable resin composition for encapsulating an optical semiconductor and a cured product thereof, which can prevent sinking after curing and have excellent property of etchant gas resistance and excellent dyeing resisting property. The curable resin composition contains epoxy resin, solidifying agent and/or solidifying booster expressed by formula (1) (in the formula, a plurality of R1 can be same or different and can independently present hydrogen atom or methyl). The curable resin composition of the invention, used as the optimized solidifying agent cyclohexane-1, 3, 4-triformic-3, 4-anhydride and methyl hexahydrophthalic anhydride, has particular effect in preventing sinking after curing.

Description

technical field The present invention relates to a curable resin composition suitable for electrical and electronic material applications, particularly optical semiconductor applications, its cured product, and an optical semiconductor device including the cured product. Background technique Conventionally, an epoxy resin composition has been used in consideration of the balance between performance and economy as a sealing material for optical semiconductor elements such as LED products. Glycidyl ether-type epoxy resin compositions typified by bisphenol A-type epoxy resins that are particularly excellent in the balance of heat resistance, transparency, and mechanical properties are widely used. However, as a result of shortening the emission wavelength of LED products (indicating the situation of 480nm or less in LED products that mainly emit blue light), the sealing material is colored on the LED chip due to the influence of short-wavelength light, and the resulting LED pr...

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Problems solved by technology

As a result, the sealing portion of the surface-mounted LED product is dented, which sometimes causes failure

In addition, depending on the degree of the depression, the electric wire portion that supplies current to the LED chip may be exposed, and in this case, the function as a sealing material may no longer be realized.

Therefore, this cycloaliphatic epoxy resin also has a problem in volatilization during heating and curing.

In addition, in recent years, LED products have become brighter for lighting or TV backlights, and LED lighting has begun to generate a lot of heat. Therefore, resin compositions using this alicyclic epoxy resin are also used in LED chips. Coloration is caused on the surface, and the final LED product has a decrease in illuminance and a problem in durability (Patent Document 3)

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