Sharp-edge grinding wheel and process for producing the sharp-edge grinding wheel

Abstract

To provide a sharp-edge grinding wheel, which can reduce damage to a workpiece and can maintain good cutting properties for a long period of time, and a process for producing the sharp-edge grinding wheel. An Ni metal bonding material(3) with abrasive grains (2) disposed in a dispersed state therein is immersed in an etching liquid to selectively remove the metal bonding material (3) in its part in contact with the periphery of the abrasive grains (2) and thus to form a gap (4) between the periphery of the abrasive grain and the metal bonding material. Thereafter, a soft metal (5) is precipitated and grown from the metal bonding material in the gap (4) to fill the gap with the soft metal (5). According to the above constitution, the periphery of the abrasive grain (2) is covered with the soft metal (5), whereby a good cushioning function can be maintained for a long period of time and chipping can be suppressed.

Description

technical field [0001] The invention relates to a thin-edged grinding wheel suitable for cutting processed objects such as ceramics and single crystal materials and a manufacturing method thereof. Background technique [0002] Conventionally, an electroformed thin-bladed grinding wheel in the shape of a thin plate ring is known as a thin-edged grinding wheel (cutting blade) for cutting workpieces such as silicon, GaAs, and ferrite with high precision. The electroformed thin-edged grinding wheel is a grinding wheel in which abrasive grains such as diamond and cBN are dispersed in a metal bond, and is formed into a ring shape of a thin plate with a thickness of about tens to hundreds of μm. The thin-edged grinding wheel holds a grinding wheel shaft in its inner peripheral region, and by rotating the grinding wheel shaft, cutting and grooving processing can be performed on a workpiece in an outer peripheral region. [0003] Due to the miniaturization of electronic parts and th...

AI Technical Summary

Problems solved by technology

In this method, although the thickness of the Sn plating layer can be ensured to some extent, since the thickness of the metal bonding material is reduced by etching, the strength of the metal bonding material decreases, and abrasive grains located on the surface layer of the metal bonding material There will be problems such as falling off

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