Two-component sealing silica gel with low viscosity and high thermal conductivity and preparation method theref

A high thermal conductivity, low viscosity technology, used in chemical instruments and methods, adhesives, other chemical processes, etc., can solve problems such as limiting the thermal conductivity of potting glue, and achieve work stability and reliability. The effect of the service life

Inactive Publication Date: 2011-02-02
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The filling of powder often increases the viscosity, and the filling amount of thermal conductive powder limits the thermal conductivity of the potting compound.

Method used

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  • Two-component sealing silica gel with low viscosity and high thermal conductivity and preparation method theref
  • Two-component sealing silica gel with low viscosity and high thermal conductivity and preparation method theref
  • Two-component sealing silica gel with low viscosity and high thermal conductivity and preparation method theref

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Accurately weigh 30.00g of vinyl silicone oil with a viscosity of 4000mPa·s, 60.00g of vinyl silicone oil with a viscosity of 200mPa·s, 20.00g of low-hydrogen silicone oil curing agent, and 30.00g of aluminum hydroxide with an average particle size of 5μm. 50.00g of 40μm spherical alumina powder and 10g of carbon black were added to the double planetary power mixer in turn, and mechanically Stir for 1 hour to obtain component A, pack and place it for use; 36.00g of vinyl silicone oil with a viscosity of 4000mPa s, 72.00g of vinyl silicone oil with a viscosity of 200mPa s, 2.00g of platinum catalyst with a concentration of 1000ppm, and an average particle size of Add 30.00g of 5μm aluminum hydroxide, 60.00g of aluminum hydroxide spherical alumina powder with an average particle size of 40μm, and 10g of carbon black into the double planetary power mixer in turn, at a vacuum degree of -0.1MPa, the rotation speed is 400 rpm / min, under the condition that the revolution spee...

Embodiment 2

[0040] Accurately say 99.00g of vinyl silicone oil with a viscosity of 1000mPa·s, 1.00g of low-hydrogen silicone oil, 30.00g of aluminum hydroxide with an average particle size of 5μm, and 6.00g of spherical alumina powder with an average particle size of 0.1μm, with an average particle size of 25.00g of 5.00μm spherical alumina powder, 30.00g of spherical alumina powder with an average particle size of 30.00μm, and 9.00g of iron red are added to the double planetary power mixer in turn, and the vacuum degree is -0.1MPa, and the rotation speed is 400 rpm / min, under the condition of revolution speed of 8 rpm, mechanically stirred for 1 hour to obtain component A, packaged and placed for use; 104.00g of vinyl silicone oil with a viscosity of 1000mPa·s, 2.00g of platinum catalyst with a concentration of 5000ppm, average 30.00g of aluminum hydroxide with a particle size of 5μm, 5.00g of spherical alumina powder with an average particle size of 0.1μm, 25.00g of spherical alumina po...

Embodiment 3

[0044] Accurately weigh 85.00g of vinyl silicone oil with a viscosity of 1000mPa·s, 16.00g of low-hydrogen silicone oil, 60.00g of spherical aluminum nitride powder with an average particle size of 5.00μm, and 110.00g of spherical alumina powder with an average particle size of 50.00μm , iron red 9.00g, added to the double planetary power mixing mixer in turn, under the conditions of vacuum degree -0.1MPa, rotation speed of 400 rpm, and revolution speed of 8 rpm, mechanically stirred for 1 hour to obtain component A, Packed and placed for use; 106.00g of vinyl silicone oil with a viscosity of 1000mPa·s, 2.00g of platinum catalyst with a concentration of 5000ppm, 60.00g of spherical aluminum nitride powder with an average particle size of 5.00μm, and spherical aluminum oxide with an average particle size of 50.00μm Add 110.00g of powder and 2.00g of carbon black into the double planetary power mixer in turn, then add into the double planetary power mixer in turn, at a vacuum deg...

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Abstract

The invention relates to a two-component sealing adhesive with low viscosity and high thermal conductivity and a preparation method thereof. The two-component sealing adhesive consists of a component A and a component B in a weight ratio of 100:80-100:125, wherein the component A comprises the following raw materials by weight percent: 40.00%-90.00% of thermal conductive powder, 4.50%-50.00% of low-viscosity liquid silicone oil, 0.50%-10.00% of silicane curing agent and 0.00-5.00% of toner; and the component B comprises the following raw materials by weight percent: 40.00%-90.00% of thermal conductive material, 9.50%-54.00% of low-viscosity liquid silicone oil, 0.04%-1.00% of catalyst and 0.00-5.00% of toner. The preparation method comprises the following steps: weighting all the raw materials according to the weight persentages to prepare the component A and the component B; and when in use, mixing the component A and the component B evenly in a weight ratio of 100:80-100:125, and curing to obtain the sealing adhesive of the invention.

Description

technical field [0001] The invention relates to a potting silica gel, in particular to a low-viscosity, high-thermal-conductivity two-component potting and a preparation method thereof, which is applicable to the potting application of various electrical components and belongs to the field of potting adhesives. Background technique [0002] With the application and development of integrated circuits in the electronic field, electronic components have become smaller, and thermal resistance and heating components have become denser, making it more and more difficult to dissipate heat from electronic materials, greatly reducing the service life and safety of electronic devices. Therefore, in order to better dissipate heat from electronic components, a thermally conductive material with high thermal conductivity is potted inside the electronic device to increase the thermal conductivity of the electronic device, thereby improving the heat dissipation efficiency of the device, pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/05C09J11/04C09J9/00C09K3/10C09J183/07
Inventor 冒小峰王建斌解海华
Owner YANTAI DARBOND TECH
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