Method for preparing light dot matrix sandwich board by laser drilling

A sandwich panel and laser cutting technology, which is applied in the field of mechanical processing, can solve the problems of poor structural performance of sandwich panels and unsuitability for mass production, and achieve the effects of high laser processing precision, small heat input, and good structural performance

Inactive Publication Date: 2012-11-21
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The object of the present invention is to solve the problem that the sandwich panel formed by the traditional method has poor structural performance and is not suitable for mass production due to its technological problems, and provides a light-weight lattice sandwich panel and a method for preparing the panel by laser cutting

Method used

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  • Method for preparing light dot matrix sandwich board by laser drilling
  • Method for preparing light dot matrix sandwich board by laser drilling
  • Method for preparing light dot matrix sandwich board by laser drilling

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specific Embodiment approach

[0031] Specific implementation method: the following combination Figure 7 Describe this embodiment, this embodiment is a kind of lightweight lattice sandwich panel, it comprises the corrugated plate 1 with hole, upper panel 2 and lower panel 3, the upper top surface of corrugated plate 1 with hole is fixed with upper panel 2 Together, the lower bottom surface of the perforated corrugated plate 1 and the lower panel 3 are fixed together, and a row of through holes is distributed on each inclined side of the perforated corrugated plate 1 . The through holes may be uniformly or unevenly distributed on the inclined side, which is determined according to actual needs.

specific Embodiment approach 2

[0032] Specific implementation mode two: the following combination Figure 1 to Figure 12 To illustrate this embodiment, this embodiment uses laser cutting to prepare the method for the lightweight lattice sandwich panel described in Embodiment 1, which includes the following steps:

[0033] Step 1, pretreating the corrugated plate to be processed;

[0034] Step 2. Place the corrugated plate horizontally on the laser processing table, and fix it with clamps;

[0035] Step 3. Start the laser cutting equipment, and punch holes on the inclined side of the corrugated board. The direction of laser punching is perpendicular to the upper top surface.

[0036] The process parameters are: laser output power is 150w~400w, cutting speed is 0.5mm / s~5mm / s, pulse width is 0.5ms~4ms, repetition frequency is 20Hz~60Hz, protective gas pressure is 10kPa~30kPa, nozzle height is 0.5mm~5mm, machining allowance is 0.1mm~0.5mm,

[0037] Step 4. After punching the holes on the corrugated board acc...

specific Embodiment approach 3

[0051] Specific embodiment three: the difference between this embodiment and embodiment two is that the laser output power is 180w-300w, the cutting speed is 1mm / s-3mm / s, the pulse width is 1ms-2ms, and the repetition frequency is 20Hz-30Hz , the shielding gas pressure is 15kPa-25kPa, the nozzle height is 0.8mm-2mm, the machining allowance is 0.1mm-0.3mm, and other structures and connection methods are the same as those in the second embodiment.

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Abstract

The invention provides a light dot matrix sandwich board and a method for preparing the same by laser drilling, belongs to the field of machining, and solves the problem that the sandwich board molded by the traditional method has poor structural performance and is not suitable for batch production due to the process problem. In the light dot matrix sandwich board, an upper top surface and an upper panel of a porous corrugated plate are fixed together, while the lower bottom surface and the lower panel are fixed together; and a row of through holes are distributed on each inclined side of theporous corrugated plate. The method for preparing the light dot matrix sandwich board by adopting laser drilling comprises the following steps of: 1, pretreating the corrugated plate; 2, horizontallyplacing the corrugated plate on a laser processing table, and clamping the corrugated plate by a clamp; 3, starting laser cutting equipment, drilling the inclined sides of the corrugated plate, and making the laser penetrating direction vertical to the upper top surface; and 4, fixing the inclined sides with the upper panel and the lower panel after the corrugated plate is drilled according to a set program so as to complete preparation of the light dot matrix sandwich board.

Description

technical field [0001] The invention relates to a method for preparing a lightweight lattice sandwich panel by laser cutting holes, and belongs to the field of mechanical processing. Background technique [0002] At present, there are mainly two kinds of light-weight lattice sandwich panels: rolling method and investment casting method for lattice sandwich panels made of metal materials; mainly two methods for lattice sandwich panels made of fiber reinforced composite materials. There are mold hot pressing method, mold assembly method, fiber weaving method and mechanical assembly method. Analyze the existing problems in the following [0003] Rolling method: Due to the elastic deformation of the metal material during the rolling process, the nodes of the lattice core are often not on the same plane, and the node area of ​​the lattice structure prepared by the rolling method is relatively small. [0004] Investment casting method: Since the metal fluidity is not very good, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/28B23K26/36B23K26/382
Inventor 吴林志熊健马力殷莎王明亮
Owner HARBIN INST OF TECH
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