Metal-core thermoelectric cooling and power generation device

A thermoelectric cooler and thermoelectric technology, which is applied in the manufacture/processing of thermoelectric devices, thermoelectric device components, and thermoelectric devices, and can solve the problems of increased contact resistance and packaging complexity and limitations of thin-film thermoelectric cooling devices

Inactive Publication Date: 2011-02-16
SHEETAK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The constraints imposed by etching significantly limit the process of materials development and the incorporation of novel films to achieve the enhanced performance of these thin-film thermoelectric cooling devices.
The integration steps of etching, patterning, etc. also lead to increases in contact resistance and packaging complexity of thin film thermoelectric cooling devices

Method used

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  • Metal-core thermoelectric cooling and power generation device
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  • Metal-core thermoelectric cooling and power generation device

Examples

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Embodiment Construction

[0018] FIG. 1 shows a cross-sectional view of a conventional thermoelectric cooling device 100 .

[0019] Conventional thermoelectric devices have one or more thermoelectric elements positioned between layers, connected to a source of direct current (DC) current. Conventional thermoelectric device 100 includes a first portion 102 and a second portion 104 . The first part 102 comprises a first layer 106 made of a material having a high thermal conductivity and a low electrical conductivity. Typically, the first layer 106 is made of aluminum nitride or thin alumina ceramic. The first portion 102 also includes a second layer 108, which is a metal interconnect having high thermal and electrical conductivity, connecting the first layer 106 to one or more thermoelectric elements. Typical examples of such materials include, but are not limited to: copper, nickel, and aluminum. Like first portion 102 , second portion 104 includes third layer 110 and fourth layer 112 . The third la...

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Abstract

In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements provided for transferring heat across the ends of the thermoelectric device. A method for making the thermoelectric device includes forming a metal substrate, and depositing one or more thermoelectric films on the metal substrate. Thereafter, one or more bumps are provided on one of the one or more thermoelectric films. Deposition of the one or more thermoelectric films on the metal substrate and the provision of the one or more bumps on the thermoelectric film result in the formation of a thermoelement.

Description

technical field [0001] The invention relates to the field of thermoelectric devices (thermoelectric devices). More particularly, the present invention relates to thin film thermoelectric devices. Background technique [0002] Thermoelectric devices are solid-state devices that convert thermal energy into electrical energy in the presence of a temperature gradient. The conversion from temperature difference to current is due to the Seebeck effect, and the opposite interaction effect capable of transferring thermal energy when electrical energy is supplied is known as the Peltier effect. Thus, a thermoelectric cooling device (also known as a Peltier device) is a solid-state heat energy pump that transfers thermal energy from one location to another when an electrical current is present. In the power generation mode, the thermoelectric device is capable of generating electricity if a temperature gradient is applied to the thermoelectric device. Thermoelectric devices hold gr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/00
CPCH01L35/34H01L35/32H01L35/16H01L35/08H10N10/817H10N10/852H10N10/01H10N10/17
Inventor 乌塔姆·戈沙尔阿扬·古哈
Owner SHEETAK INC
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