Near-infrared room temperature luminescent device based on automatic ion implantation of SOI (silicon on insulator) material
A light-emitting device, near-infrared technology, applied in the field of optoelectronics, can solve problems such as no public reports, achieve simple process, low power consumption, and improve external quantum efficiency
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Embodiment 1
[0018] The present invention is by injecting Si into the silicon film layer of SOI structure + , to obtain efficient D at room temperature 1 Line light-emitting device, the specific steps are as follows:
[0019] Step 1: Select a P-type single crystal Si wafer with a crystal orientation of (100), polish it on one side, and clean the substrate with the existing technology.
[0020] Step 2: Prepare thin film surface silicon layer and SiO with uniform thickness by SIMOX method 2 buried layer.
[0021] Step 3: Si + Ion implanted silicon thin film layer
[0022] Si by ion implanter + Self-implanted silicon thin film layer, the injection dose is 10 12 cm -2 , the injection energy is 200keV. Si + After the ion implantation is completed, the S + Ions were implanted into this layer, and the implantation energy and dose were 80keV and 10 14 cm -2 , S + Due to diffusion will form n + type layer. The included angle between the ion beam and the surface normal of the silicon ...
Embodiment 2
[0028] Step 1, step 2, step 4, and step 5 are the same as in embodiment 1.
[0029] The difference in step 3 is:
[0030] Si by ion implanter + Self-implanted silicon thin film layer, the injection dose is 10 14 cm -2 , the injection energy is 200keV.
Embodiment 3
[0032] Basically with embodiment 1. The differences are:
[0033] Si by ion implanter + Self-implanted silicon thin film layer, the injection dose is 10 16 cm -2 , the injection energy is 200keV.
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