Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same

A technology of alkali-soluble polymers and photosensitive resins, which is applied in the field of photosensitive resin compositions, and can solve problems such as low glass transition temperature, large curing shrinkage, and low sensitivity

Active Publication Date: 2011-03-30
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0024] Compared with the surface protection film and interlayer insulation film composed of photosensitive polyimide precursor composition, the surface protection film and interlayer insulation film of conventional semiconductor devices have problems caused by the absorption wavelength of the photosensitizer The problem of low sensitivity, the PBO precursor and PI precursor accompanied by cyclization have a large curing shrinkage caused by cyclization, and because the glass transition temperature before cyclization is low, the relief pattern obtained after heat treatment and development (hereinafter This process is called "curing"

Method used

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  • Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same
  • Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same
  • Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same

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Experimental program
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Embodiment

[0497] Hereinafter, the present invention will be described based on reference examples, examples, and comparative examples.

[0498] Bis (carboxy) tricyclic [5, 2, 1, 0 2，6 ] Manufacture of decane

reference example 1

[0500] In a detachable three-necked glass flask equipped with an anchor stirrer made by Teflon (registered trademark), add 71.9g (0.366mol) tricyclic [5,2,1,0 2，6 ] Decanedimethanol (manufactured by Tokyo Chemical Industry Co., Ltd.) dissolved in 1L of acetonitrile, 256.7g (1.808mol) of disodium hydrogen phosphate and 217.1g (1.809mol) of sodium dihydrogenphosphate were dissolved in 1.4L of ion-exchanged water obtained substance. 2.8 g (0.0179 mol) of 2,2,6,6-tetramethylpiperidine-1-oxyl (manufactured by Tokyo Chemical Industry Co., Ltd., hereinafter also referred to as "TEMPO") was added thereto, and stirred to dissolve.

[0501] 143.2 g (1.267 mol) of 80% sodium chlorite was diluted with 850 mL of ion-exchanged water, and this was added dropwise to the reaction liquid. Next, what diluted 3.7 mL of 5% sodium dichlorite aqueous solution with 7 mL of ion-exchanged water was dripped at the reaction liquid. The reaction liquid was kept at 35-38° C. by a constant temperature lay...

reference example 2

[0505] Two (carboxy) tricyclic [5,2,1,0 2，6 ] Decane, 97mL (1.33mol) of thionyl chloride, and 0.4mL (5.0mmol) of pyridine were added to the reaction vessel, stirred at 25-50°C for 18 hours, and allowed to react. After the reaction was finished, toluene was added, and the excess thionyl chloride was azeotroped with toluene to concentrate under reduced pressure to obtain 73.3 g (yield 100%) of oily bis(chlorocarbonyl)tricyclo[5,2,1, 0 2，6 ] Decane.

[0506] Synthesis of Photoacid Generator (B) Naphthoquinonediazide Compound

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Abstract

The present invention provides an alkali-soluble polymer, a photosensitive resin composition comprising the same, and uses of the same, in particular, the invention provides the alkali-soluble polymer with low curing shrinkage (high plastic residue rate in curing), the photosensitive resin composition capable of forming an excellent pattern shape after curing, a method of manufacturing a curing bas-relief pattern by using the composition, and a semiconductor device and a light-emitting device containing the curing bas-relief pattern. The alkali-soluble polymer has a structure composing of a multicomponent amino compound and at least a carboxyl acid compound selected from a group composed of free polybasic carboxylic acid and derivatives thereof, and a structure containing a crosslinked group formed by reacting with said polybasic carboxylic acid or derivatives thereof.

Description

technical field [0001] The present invention relates to a photosensitive resin composition as a precursor of a heat-resistant resin used as a surface protection film and an interlayer insulating film of a semiconductor device, and a heat-resistant cured relief pattern using the photosensitive resin composition A manufacturing method, and a semiconductor device having the cured relief pattern. Background technique [0002] Polyimide resins having excellent heat resistance, electrical properties, mechanical properties, and the like are widely used for surface protection films and interlayer insulating films of semiconductor devices. Most of these polyimide resins are currently provided as photosensitive polyimide precursor compositions. In the process of manufacturing a semiconductor device, the precursor composition is coated on a substrate such as a silicon wafer, patterned by active light rays, developed, and thermal imidization treatment is applied, so that the semiconduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10G03F7/039H01L21/3105H01L23/29
Inventor 涩井智史金田隆行汤之口智惠
Owner ASAHI KASEI KK
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