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Method for manufacturing multilayer printed circuit board

A technology for printed circuit boards and manufacturing methods, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of expensive equipment, increased manufacturing costs, and lengthy processes, so as to shorten the process process, improve the bonding force of inner layers, and avoid oxidation pollution. Effect

Inactive Publication Date: 2013-01-16
SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The pattern transfer process of its conductive layer adopts photoresist dry film, but the price of such materials is high, the equipment is expensive, and the process is lengthy. After the pattern transfer process is completed, the photoresist dry film is removed. Therefore, the conductive circuit on the conductive layer copper foil 5 after brown oxidation is exposed in the air, without material protection, it is easy to oxidize and pollute the circuit, transport scratches and other quality defects
In addition, before entering the lamination process, the conductive layer needs to be roughened and deoxidized, which adds additional manufacturing costs

Method used

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  • Method for manufacturing multilayer printed circuit board
  • Method for manufacturing multilayer printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] A method for manufacturing a multilayer printed circuit board in this embodiment includes the following steps: performing inner layer processing on the multilayer board at least twice, performing outer layer processing on the multilayer board, and subsequent auxiliary processing; The inner layer processing of the board includes the following sub-steps in turn:

[0092] 1) inner layer cutting board;

[0093] 2) CNC drilling;

[0094] 3) Hole inspection;

[0095] 4) to drill dirt;

[0096] 5) Hole pretreatment and electroless copper plating;

[0097] 6) Copper plating on the whole board;

[0098] 7) Coating inspection;

[0099] 8) Coating inspection;

[0100] 9) Pre-treatment;

[0101] 10) coating photoresist;

[0102] 11) Exposure;

[0103] 12) developing;

[0104] 13) Etching;

[0105] 14) Inner inspection;

[0106] 15) lamination;

[0107] The outer layer processing of the multi-layer board includes the following sub-steps in turn:

[0108] 1) Trimming an...

Embodiment 2

[0132] The difference between the manufacturing method of a kind of multilayer printed wiring board of this embodiment and embodiment 1 is:

[0133] Described photocurable resin photoresist comprises the component of following content:

[0134] Biphenol type epoxy resin - 80%;

[0135] Methoxydiethylene glycol diacrylate - 10%;

[0136] Benzoin methyl ether - 2%;

[0137] Barium titanate - 5%;

[0138] Phthalocyanine blue - 2%;

[0139] Petroleum ether - 1%.

[0140] The coating process selects the curtain method. The thickness of the resin photoresist is 20um.

Embodiment 3

[0142] The difference between the manufacturing method of a kind of multilayer printed wiring board of this embodiment and embodiment 1 is:

[0143]Described photocurable resin photoresist comprises the component of following content:

[0144] Phenol novolac epoxy resin - 65%;

[0145] Methoxytriethylene glycol diacrylate - 25%;

[0146] Benzoin propyl ether - 1%;

[0147] Silica powder - 3%;

[0148] Phthalocyanine blue - 1%;

[0149] Methyl ethyl ketone - 5%.

[0150] The coating process selects the spraying method. The thickness of the resin photoresist is 15um.

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Abstract

The invention relates to a method for manufacturing a multilayer printed circuit board, which comprises the following steps of: carrying out inner layer processing on a multilayer board for at least two times; and carrying out outer layer processing on the multilayer board. The step of carrying out inner layer processing on the multilayer board sequentially comprises the following sub steps of: 1, inner layer board cutting; 2, numerical control drilling; 3, desmearing; 4, hole pretreatment and electroless copper plating; 5, copper plating of the whole board; 6, coating detection; 7, pretreatment; 8, photoresist coating; 9, exposure; 10, developing; 11, etching; and 12, lamination. The step of carrying out outer layer processing on the multilayer board sequentially comprises the following sub steps of: 1, trimming and drilling a positioning hole; 2, processing an outer pattern; 3, forming a soldering-resistance film; 4, printing a character patter; 5, carrying out final surface processing; and 6, carrying appearance processing. The method adopts the step of coating a resin photoresist, so that two steps of removing the film and roughening and deoxidizing an inner layer in the step of inner layer processing can be saved and the process flow is shortened.

Description

technical field [0001] The invention relates to a manufacturing method of a multilayer printed circuit board. Background technique [0002] PCB is the abbreviation of English (Printed Circuie Board) printed circuit board. Usually on the insulating material, according to the predetermined design, the conductive pattern made of printed circuit, printed component or a combination of the two is called printed circuit. The conductive pattern that provides electrical connection between components on an insulating substrate is called a printed circuit. In this way, the finished board of printed circuit or printed circuit is called printed circuit board, also known as printed board or printed circuit board. [0003] Almost all electronic devices we can see are inseparable from PCBs, ranging from electronic watches, calculators, general-purpose computers to large computers, communication electronic equipment, and military weapon systems. As long as there are electronic components s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
Inventor 何润宏刘建生黄志东
Owner SHANTOU ULTRASONIC PRINTED BOARD NO 2 FACTORY