Heat radiator and manufacturing method thereof

Abstract

The invention relates to a heat radiator, which comprises a heat conducting plate and a heat radiating fin group. The heat conducting plate comprises a first plate, and the top surface of the first plate is provided with a plurality of lugs arranged side by side at intervals. The heat radiating fin group comprises a plurality of heat radiating units, each heat radiating unit is provided with a bottom sheet and two side sheets, the bottom sheets are appressed to the top surface of the first plate, and the two side sheets are partially appressed onto the adjacent lugs. In the invention, the bottom surface of the first plate can be provided with a transverse trench penetrating to the top surface so as to ensure that the bottom sheets of the heat radiating units are exposed in the transverse trench, the heat radiator comprises a plurality of heat pipes arranged in the transverse trench and appressed to the bottom sheets of the heat radiating units, and the heat conducting plate comprises a second plate combined onto the bottom surface of the first plate. A preferable manufacturing method of the heat radiator comprises the steps of: embedding each heat radiating unit between every two adjacent lugs correspondingly; coating solder paste in the transverse trench; assembling the heat pipes in the transverse trench; coating the solder paste on the top surface of the second plate and covering the top surface of the second plate at the bottom surface of the first plate; and heating the solder paste to weld the structural members into a whole.

Description

technical field [0001] The invention relates to a heat sink, in particular to a heat sink with good heat dissipation effect, good stability, simple manufacture and assembly and a manufacturing method thereof. Background technique [0002] Taiwan Patent Publication No. M346014 discloses a common heat sink structure, which is mainly composed of a heat dissipation fin set and a heat conduction bottom plate, and the two are combined with solder paste or heat conduction glue. However, each heat dissipation unit in the heat dissipation fin set only relies on a small area of ​​long and narrow fins at the bottom to absorb heat from the heat conduction bottom plate, so the overall heat dissipation efficiency is not good. Moreover, the heat dissipation fin assembly only uses solder paste or heat conduction adhesive to bond the bottom surface to the heat conduction bottom plate, so its lateral bearing capacity is relatively poor. Therefore, the stability of the combination of the two ...

AI Technical Summary

Problems solved by technology

However, each heat dissipation unit in its heat dissipation fin group only relies on a small area of ​​narrow strips at the bottom to absorb heat from the heat conduction base plate, so the overall heat dissipation efficiency is not good

Moreover, the heat dissipation fin group only uses solder paste or heat-conducting adhesive to bond the bottom surface to the heat-conducting bottom plate, so its lateral bearing capacity is relatively poor.

Therefore, the stability of the combination of the two is not good, and it is easy to loosen.

[0003] Taiwan Announcement No. M337724 patent discloses a sandwich type heat dissipation module, although it can improve the above-mentioned problem of poor stability in combination, and each heat dissipation unit of the heat dissipation fin group relies on the parts in contact with the copper sandwich components on both sides and The part where the bottom surface is in contact with the copper base conducts heat. Although it has a larger heat conduction area, the overall heat dissipation rate is better than the above.

However, its multiple metal fins and copper sandwich components need to be tightly locked together by bolts, so the production and assembly are time-consuming and labor-intensive

Images