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Heat conductivity coefficient quick test device and method of vacuum insulating board

A technology of vacuum insulation panels and thermal conductivity, applied in the direction of material thermal development, etc., can solve the problems of not more than the test requirements, time-consuming vacuum insulation panels, and harsh test requirements, etc., to shorten the time for sample replacement, shorten the time for thermal equilibrium, Significant energy saving effect

Inactive Publication Date: 2012-07-25
SHANGHAI MARITIME UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, while the equipment is expensive, its test requirements are too harsh, and it can only be used to test vacuum insulation panels of specified size. Not greater than or not too smaller than this range
In actual production, with the improvement of production technology and the development of mechanical processing technology, the production equipment that can produce 1000×800×40mm vacuum insulation panels has been applied to the production line. Such demanding requirements have been difficult to meet the needs of vacuum insulation panel testing.
In addition, the existing vacuum insulation panel testing device takes a long time to test the vacuum insulation panel, and the efficiency is low. Generally, it takes more than half an hour to test a vacuum insulation panel with specified requirements. Such extremely low efficiency is difficult to cope with the current large-scale production situation.
In view of the limitations of existing testing equipment, most manufacturers can only produce small sample test data that meet the test requirements under the same production conditions, processes and raw materials for the owner's reference, but cannot test large-scale vacuum insulation panels.

Method used

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  • Heat conductivity coefficient quick test device and method of vacuum insulating board
  • Heat conductivity coefficient quick test device and method of vacuum insulating board
  • Heat conductivity coefficient quick test device and method of vacuum insulating board

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Embodiment Construction

[0020] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the following is attached figure 2 , The structural principle of the present invention is further described in detail.

[0021] Such as figure 2 As shown, the thermal conductivity test device for vacuum insulation panels of the present invention includes a power supply 4, a temperature acquisition and data processing device 25, and a test hemisphere 8. The test hemisphere 8 includes an inner hemisphere 21, an outer hemisphere 22, and a bottom plate 27. The hemisphere 21 and the outer hemisphere 22 are concentric. In order to ensure the uniformity of the internal temperature field distribution of the test device, the inner and outer hemispheres of the device are filled with fluids with good heat capacity and thermal conductivity (such as water, glycol, grease, etc.). The bottom plate 27 seals the inner hemisphere 21 and the outer hemisphere 22. The...

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Abstract

The invention provides a heat conductivity coefficient quick test device and method of a vacuum insulating board. The heat conductivity coefficient quick test device mainly comprises a test hemisphere consisting of an inner hemisphere, an outer hemisphere and a base plate, wherein the outer hemisphere is used as a thermal protection sphere; the inner hemisphere is used as a test sphere; fluid with favorable heat-conducting performance and heat capacitance is filled and sealed in the hemisphere; liquid in the outer hemisphere is heated to the set temperature; an additional heating device in the inner hemisphere is opened to heat the liquid in the inner hemisphere to the set temperature; a test sample plate is laid below an experimental device to test and acquire the point-testing temperature corresponding to the center of the inner hemisphere on the lower surface of the sample plate; and the temperature is read after being stabilized. The heating power of the inner hemisphere is used as the heat flow of the sample plate; a round bottom surface of the inner hemisphere is used as a test area; and the heat conductivity coefficient can be solved according to a formula. The device has the advantages of simple structure, simple operation process, short test time, high efficiency, accurate test result and remarkable energy-saving effect and is portable.

Description

Technical field [0001] The invention relates to the technical field of thermal testing, in particular to a device and a method for quickly measuring the thermal conductivity of a vacuum insulation board. Background technique [0002] In today's rapid economic development mode, environmental protection and energy saving and emission reduction have become two major themes. Research and development of an environmentally friendly and efficient insulation material is an urgent need to alleviate energy depletion and environmental pollution, and vacuum insulation technology is in this background The next came into being. Countries in the world are actively developing vacuum insulation products, and vacuum insulation panels have penetrated into various fields of economic life and played an important role. And testing whether vacuum insulation panels meet performance requirements has become a bottleneck restricting the development of the industry. [0003] At present, most of the equipmen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
Inventor 阚安康韩厚德周家明
Owner SHANGHAI MARITIME UNIVERSITY
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