Method for processing attachments on double surfaces of glass
A processing method and attachment technology, applied in electrical components, conductive layers on insulating carriers, circuits, etc., can solve problems such as damage to glass films
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[0028] The above and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings.
[0029] Please refer to Figure 1 to Figure 3 , figure 1 It is a processing flowchart of the present invention; figure 2 It is a schematic cross-sectional structure diagram of a film attached to both sides of a glass substrate; image 3 is the transmittance of various glasses under different wavelengths of laser light; Figure 4 It is a relationship diagram of the transmittance of lasers with different wavelengths to the glass substrate in the short wavelength region.
[0030] First, see figure 1 , the glass double-sided attachment processing method of the present invention at least comprises the following steps:
[0031] Step 10: Provide laser processing device
[0032] Provide a laser processing device, the laser emitted by the laser processing device is a laser with a transmittance below 50%, and ...
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Abstract
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