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Method for processing attachments on double surfaces of glass

A processing method and attachment technology, applied in electrical components, conductive layers on insulating carriers, circuits, etc., can solve problems such as damage to glass films

Inactive Publication Date: 2011-04-20
GALLANT PRECISION MACHINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the high-transmittance laser is used to process the membranous objects on both sides of the glass, it is easy to cause the aforementioned problem of damaging the membranous objects on the other side of the glass.

Method used

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  • Method for processing attachments on double surfaces of glass
  • Method for processing attachments on double surfaces of glass
  • Method for processing attachments on double surfaces of glass

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Embodiment Construction

[0028] The above and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings.

[0029] Please refer to Figure 1 to Figure 3 , figure 1 It is a processing flowchart of the present invention; figure 2 It is a schematic cross-sectional structure diagram of a film attached to both sides of a glass substrate; image 3 is the transmittance of various glasses under different wavelengths of laser light; Figure 4 It is a relationship diagram of the transmittance of lasers with different wavelengths to the glass substrate in the short wavelength region.

[0030] First, see figure 1 , the glass double-sided attachment processing method of the present invention at least comprises the following steps:

[0031] Step 10: Provide laser processing device

[0032] Provide a laser processing device, the laser emitted by the laser processing device is a laser with a transmittance below 50%, and ...

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Abstract

The invention relates to a method for processing attachments on double surfaces of glass. The method mainly comprises the following steps of: providing a laser processing device which selects and uses laser with penetration rate of less than 50 percent; providing a glass substrate, wherein membrane-shaped objects are attached to the double surfaces of the glass substrate; exciting the laser processing device to generate the laser; and irradiating the membrane-shaped objects attached to the double surfaces of the glass substrate by using the laser so as to carve patterns or remove unnecessary parts from the membrane-shaped objects and form the membrane-shaped objects with the required patterns on the double surfaces of the glass substrate.

Description

technical field [0001] The invention relates to a method for processing a glass double-sided attachment, in particular to a method for processing a film attached to a glass double-sided by a laser with a low transmittance. Background technique [0002] In the field of optoelectronic technology, various films are often attached to both sides of the glass substrate, so as to achieve electrical or optical effects through these films. [0003] For example: the conductive film is plated on both sides of the glass by plating. In terms of conductive film, it can be roughly divided into two categories: transparent film and opaque film. Transparent conductive film includes indium tin oxide (ITO) film, zinc oxide (ZNO) film, nitride (AZO) film and so on. Opaque films include molybdenum (Mo) films, cadmium telluride (CdTe) films, copper indium gallium selenide (CIGS) films, polysilicon films, etc.; or adhere optical films on both sides of the glass by adhesion, such as: Polarizer, po...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B5/14G02F1/133
Inventor 陈文注
Owner GALLANT PRECISION MACHINING CO LTD