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Processing method of detecting samples

A technology for detecting samples and processing methods, used in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc., and can solve problems such as high cost, copper interconnections react, and operators cannot perform it immediately. , to achieve the effect of low price, quality assurance and production cost saving

Inactive Publication Date: 2012-10-03
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

First of all, after the test sample is produced, if the operator cannot perform the failure analysis process immediately due to some factors, and during this period, the copper interconnection is very likely to react, resulting in failure analysis.
Secondly, after the test sample is made, it is generally not only a failure analysis, but repeated failure analysis is often required. Once the metal interconnection line is removed, it is impossible to perform multiple failure analysis for the metal interconnection line of a test sample. Measurement
[0006] The industry also adopts another method to process the test samples, which is to store the test samples with metal interconnections in a nitrogen cabinet to avoid the contact of copper interconnects with oxygen and moisture in the air, and to prevent the chemical reaction between copper and oxygen. However, although this method of processing test samples can better solve the problem of copper oxidation, the cost is very high. Not only does it need to purchase a nitrogen cabinet to store the test samples, but also needs to continuously feed nitrogen into the nitrogen cabinet.

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Embodiment Construction

[0025] The invention will now be described in more detail with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it being understood that those skilled in the art may modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0026] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific goals, such as changing from one embodiment to another in accordance with system-related or busi...

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Abstract

The invention provides a processing method of a detecting sample, comprising the following steps: providing a detecting sample; and coating an organic thin film on the detecting sample surface. The processing method has the advantages of being simple and practical, having low cost, effectively avoiding oxidizing reaction due to the detecting sample in contact with oxygen in air, and ensuring the quality of the detecting sample.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a processing method for detection samples. Background technique [0002] In the manufacturing process of integrated circuits, various process factors are often interlocking, that is to say, the defects produced in the previous process step often also produce relative defects in the next process, so that the final product is finished. rate problem. Therefore, being able to analyze the defects that have occurred in real time, find out the cause of the defects, and eliminate them has become one of the core capabilities of product quality assurance. With the continuous shrinking of the size of semiconductor devices, the size of defects caused by the semiconductor process and enough to affect the yield is also continuously miniaturized. Under this trend, it has become more and more difficult to make accurate cross-sectional analysis of these tiny defects. Therefore, v...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/66C08L1/12
Inventor 陈强郭志蓉
Owner SEMICON MFG INT (SHANGHAI) CORP