Improved development process for light beam homogenization device

A beam and laser beam technology, applied in optics, optical components, instruments, etc., can solve problems such as restricted processing capability, difficulty in ensuring lens curvature and surface accuracy, and difficulty in obtaining uniformity of light spots.
CN102053372AInactive Publication Date: 2011-05-11TSINGHUA UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
TSINGHUA UNIV
Publication Date
2011-05-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to an improved development process for a light beam homogenization device. The device can be applied to laser annealing or other fields having demand on homogenizing light beams. The improved development process provided by the invention is characterized in that the pre-homogenization process is introduced, a random phase plate, a lens array and an integral rod are organically combined, multistage homogenization is carried out on the light beams and the coherence influence is eliminated, thus the effect of homogenizing light beams is greatly increased, the demand on processing lens array is reduced, and the cost is lowered.
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Description

technical field

[0001] The invention belongs to a laser beam homogenization device, which improves the existing beam homogenization device and is suitable for laser processing fields such as laser annealing or other occasions where laser beam homogenization is required. Background technique

[0002] In recent decades, integrated circuit manufacturing has followed Moore's law and experienced rapid growth. The development of integrated circuits has driven the continuous progress of the entire electronics industry. The rapid development of the electronics industry has become a major engine driving the country's economic growth. However, due to the continuous improvement of the manufacturing precision of integrated circuits, it has also brought great difficulties and challenges in terms of extremely small size process technology.

[0003] At present, the manufacture of very large scale integrated circuits has entered the stage of 32nm and below. For the technology node of 32nm,...

Claims

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