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Electronic device casing and manufacturing method thereof

A technology of an electronic device and a manufacturing method, which is applied to antenna supports/installation devices, circuits, electrical components, etc., can solve problems such as affecting the transmission and reception function of antenna signals, and the antenna is easy to fall off and wear, so as to achieve increased added value and small space. Effect

Inactive Publication Date: 2011-05-11
SHENZHEN FUTAIHONG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the antenna is placed on the outer surface of the casing, there are defects that the antenna is easy to fall off and be worn out, which affects the signal sending and receiving function of the antenna

Method used

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  • Electronic device casing and manufacturing method thereof
  • Electronic device casing and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] see figure 1 As shown, the electronic device casing 10 of a preferred embodiment of the present invention includes a transparent or translucent film layer 11, an antenna 13 formed on one surface of the film layer 11, and a protective layer formed on the surface of the antenna 13 and the film layer 11 15 , and a base 17 formed on the surface of the protective layer 15 .

[0014] The film layer 11 can be a plastic layer. The plastic can be selected from transparent or translucent polypropylene (PP), polyamide (PA), polycarbonate (PC), polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA) ) in any one.

[0015] The antenna 13 can be a conductive layer, such as a conductive ink layer. The conductive ink layer can be formed by screen printing. The conductive ink used for printing the conductive ink layer contains conductive components, such as silver powder or copper powder. The conductive ink also contains resin, hardener, solvent and additives. The resi...

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PUM

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Abstract

The invention provides an electronic device casing and a manufacturing method thereof. The electronic device casing comprises a transparent or translucent film layer, a substrate and an antenna, wherein the antenna is arranged between the film layer and the substrate, is a conducting layer, is provided with a predetermined pattern, and is provided with an electrical contact, and the substrate is combined to the surface of the antenna in an injection molding mode. The manufacturing method of the electronic device casing comprises the following steps: providing the transparent or translucent film layer; arranging the conducting layer with the predetermined pattern in the partial region of the surface of the film layer to form the antenna, wherein the antenna is provided with the electrical contact; and placing the film layer which has the antenna in a molding mold, and injecting plastics on the surface of the antenna to form the substrate.

Description

technical field [0001] The invention relates to an electronic device casing and a manufacturing method thereof, in particular to an electronic device casing integrated with an antenna and a manufacturing method of the electronic device casing. Background technique [0002] With the rapid development of information technology, applications of portable electronic devices such as mobile phones and personal digital assistants are increasingly common. Whether the appearance of these electronic device casings is novel, whether the weight is light, and whether the characteristics of portability are more and more people's attention and attention. In addition, the signal sending and receiving effect of the portable electronic device is also highly valued by consumers. The setting of the antenna is an important factor to determine the effect of sending and receiving signals of the portable electronic device. Therefore, how to balance the signal receiving and receiving effect of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22B29C45/14
CPCB29C45/14811B29C2045/14844B29K2995/0005B29K2995/0026H01Q1/243H01Q1/40
Inventor 熊邺郝卫东
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD