Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Technology and system for recycling high-purity cut silicon powder

A recovery system and silicon powder technology, applied in the fields of physics and semiconductor materials, can solve the problems of long process cycle, large energy consumption, and high recovery cost, and achieve the effects of purifying the environment, reducing energy consumption, and improving efficiency

Inactive Publication Date: 2015-04-22
朱福如
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

They are all carried out in a liquid medium, which will inevitably introduce new impurities and cause pollution to the environment. The process cycle is long, energy consumption is large, and recycling costs are high.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Technology and system for recycling high-purity cut silicon powder
  • Technology and system for recycling high-purity cut silicon powder
  • Technology and system for recycling high-purity cut silicon powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] (1): Three-dimensional space separation system:

[0018] Refer to attached figure 1 , Bottom feeding silicon powder recovery device is composed of high-pressure air source; magnetic field pole; low melting point colloidal baffle; electrostatic field electrode; alternating electromagnetic field coil; centrifugal fan;

[0019] The high-pressure air source is composed of a purification filter system, pipes, nozzles and centrifugal fans. The gas inlet is connected to the silica powder recovery sedimentation tank and the purified gas source, and the gas outlet is connected to the nozzle by the pipe.

[0020] The magnetic poles of the magnetic field are composed of permanent magnets and hard magnetic tapes, and are installed downstream of the inlet pipeline of the silicon powder to be recovered in the recovery system. The permanent magnet is fixed on the pipe, and the hard magnetic tape is attached to the surface of the permanent magnet to contact with the silicon powder ai...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a technology for recycling high-purity cut silicon powder by a dry method. A semiconductor device (comprising an integrated circuit and a solar battery) mostly is processed by cutting a silicon ingot (stick) into sheets; and the cut silicon powder can be recycled only if various blended foreign substances and impurities, particularly harmful iron impurities are eliminated. The conventional method for recycling the high-purity cut silicon powder by acid pickling and flotation comprises the steps of: performing chemical reaction on the foreign substances and the impurities, and selectively sorting the silicon powder according to the difference between the surface tension and the adhesive force of the substances. The steps of the conventional method are performed in the liquid medium, so new impurities are introduced certainly and environment is polluted; and the process period is long, the energy consumption is high and the recycling cost is high. The technology comprises the steps of: separating the cut silicon powder, and the foreign substances and the impurities into monomer particles which are suspended on a bidimensional plane and in a three-dimensional space by using airflows, namely turbulent flows with specified performance, and sorting the suspended particles in an electrostatic field, a magnetostatic field, an electromagnetic field and a centrifugal force field. The environmental pollution is reduced, the energy is saved, the efficiency is improved and the cost is reduced.

Description

1 Technical field: [0001] The invention belongs to the category of physics and semiconductor materials, and in particular relates to a method and system for recovering high-purity cut silicon powder. 2 background technology: [0002] Existing semiconductor devices (including integrated circuits and solar cells) are mostly processed by cutting silicon ingots (rods) into sheets, and the recovery of cut silicon powder requires the removal of various foreign impurities, especially harmful iron impurities. [0003] In the past, the method of pickling was used to chemically react foreign matter impurities with acid, and the solid material was changed into a soluble liquid for separation; recently, some people used the flotation method, using the difference in surface tension and adhesion of the material to selectively separate the silicon Powder sorting. They are all carried out in a liquid medium, which will inevitably introduce new impurities and cause pollution to the environm...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B03C1/30B03C3/017
Inventor 朱福如
Owner 朱福如
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products