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Radiating device integrating radiating plate and electrode and manufacturing method thereof

A technology of heat dissipation device and heat dissipation plate, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of short service life and poor chip heat dissipation effect, and achieve the effect of improving service life, soft light and reducing cost.

Inactive Publication Date: 2011-06-29
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a heat dissipation device integrating a heat dissipation plate and an electrode and its preparation method, so as to solve the problems of poor heat dissipation effect and short service life of the chip

Method used

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  • Radiating device integrating radiating plate and electrode and manufacturing method thereof
  • Radiating device integrating radiating plate and electrode and manufacturing method thereof

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Embodiment Construction

[0012] The present invention is described in detail below in conjunction with accompanying drawing:

[0013] Such as figure 1 , 2 As shown, the heat dissipation device integrating the heat dissipation plate and the electrode of the present invention includes: a heat dissipation plate 1, an LED chip 2 fixed on the heat dissipation plate 1, a phosphor layer 3 coated on the heat dissipation plate 1 and completely covering the LED chip 2 , the silicone encapsulation layer 4 coated on the phosphor layer 3 , the electrode pin 5 integrated on the heat sink 1 , and the electrode lead 6 drawn out from the electrode pin 5 .

[0014] The LED chips 2 are connected in series, parallel or mixed connection by bonding wires, and fixed on the cooling plate 1 .

[0015] The phosphor layer 3 is coated on the heat dissipation plate 1 and covers the LED chip 2 .

[0016] The silica gel encapsulation layer 4 is formed by mixing silica gel and nano or micro particles, wherein the mass ratio of si...

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Abstract

The invention discloses a radiating device integrating a radiating plate and an electrode and a manufacturing method thereof. The radiating device comprises the radiating plate (1), a light-emitting diode (LED) chip (2) fixed onto the radiating plate (1), a fluorescent powder layer (3) coated on the radiating plate (1) and totally covering the LED chip (2), a silica gel sealing layer (4) coated on the fluorescent powder layer (3), an electrode pin (5) integrated on the radiating plate and an electrode lead (6) leaded from the electrode pin (5), wherein the silica gel sealing layer (4) is madeby mixing silica gel and nanometer or silica and micrometer particles. In the radiating device provided by the invention, the radiating plate is directly connected with the electrode pin, thereby improving the radiating efficiency of the chip and solving the problem of short service life of the device due to radiation problem; moreover, due to the elimination of bracket, the production cost is reduced and the invention is more favorable for commercial production.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device integrating a heat dissipation plate and an electrode and a preparation method thereof. Background technique [0002] LED is considered to be a new type of cold light source with the most development prospects in the 21st century. The LED industry is considered to be one of the industries with the most development potential in recent years. Everyone expects that LED can enter the general lighting market and become a new lighting source. With the launch of the Copenhagen Conference and low-carbon economic issues, LED will enter the general lighting market on a large scale, and its economic output value has exceeded 10 billion US dollars. LED is a solid-state semiconductor device that can directly convert electricity into light. It is an ideal light source to replace traditional light sources. It has a wide range of uses and many advantages, such as: small size...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/62H01L33/56H01L33/00
Inventor 张方辉毕长栋
Owner SHAANXI UNIV OF SCI & TECH
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